JPS61158969U - - Google Patents
Info
- Publication number
- JPS61158969U JPS61158969U JP1985042245U JP4224585U JPS61158969U JP S61158969 U JPS61158969 U JP S61158969U JP 1985042245 U JP1985042245 U JP 1985042245U JP 4224585 U JP4224585 U JP 4224585U JP S61158969 U JPS61158969 U JP S61158969U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- photodiode
- laser device
- semiconductor substrate
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
- H01S5/0202—Cleaving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Lasers (AREA)
Description
第1図乃至第2図は本考案半導体レーザ装置の
実施の一例を示すもので、第1図は斜視図、第2
図は第1図の2―2線に沿う断面図、第3図A乃
至Dは第1図及び第2図に示した半導体レーザ装
置の製造方法を工程順に示す斜視図、第4図はカ
ツテイング時の状態を示す断面図、第5図は検査
方法を説明するためのもので、同図Aは平面図、
同図Bは断面図、第6図は半導体レーザ装置の1
つの従来例を示す斜視図、第7図A乃至Eは第6
図に示した半導体レーザ装置の製造方法を工程順
に示す斜視図である。 符号の説明、1…半導体基板、3…半導体レー
ザ素子、5…APC用フオトダイオード、8,9
a,9b,9c…検査用フオトダイオード。
実施の一例を示すもので、第1図は斜視図、第2
図は第1図の2―2線に沿う断面図、第3図A乃
至Dは第1図及び第2図に示した半導体レーザ装
置の製造方法を工程順に示す斜視図、第4図はカ
ツテイング時の状態を示す断面図、第5図は検査
方法を説明するためのもので、同図Aは平面図、
同図Bは断面図、第6図は半導体レーザ装置の1
つの従来例を示す斜視図、第7図A乃至Eは第6
図に示した半導体レーザ装置の製造方法を工程順
に示す斜視図である。 符号の説明、1…半導体基板、3…半導体レー
ザ素子、5…APC用フオトダイオード、8,9
a,9b,9c…検査用フオトダイオード。
Claims (1)
- 【実用新案登録請求の範囲】 半導体基板の表面の前側領域上に半導体レーザ
素子を固着し、 上記半導体基板の表面の後側領域表面部に検査
用フオトダイオードを形成し、 上記半導体基板の表面の中間領域にAPC用フ
オトダイオードを形成し、 てなることを特徴とする半導体レーザ装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985042245U JPH0419819Y2 (ja) | 1985-03-23 | 1985-03-23 | |
KR2019860002759U KR920002914Y1 (ko) | 1985-03-23 | 1986-03-10 | 반도체 레이저장치 |
EP86302086A EP0196200B1 (en) | 1985-03-23 | 1986-03-20 | Semiconductor laser devices |
DE8686302086T DE3680223D1 (de) | 1985-03-23 | 1986-03-20 | Halbleiterlaser-vorrichtung. |
US06/841,797 US4764931A (en) | 1985-03-23 | 1986-03-20 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985042245U JPH0419819Y2 (ja) | 1985-03-23 | 1985-03-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61158969U true JPS61158969U (ja) | 1986-10-02 |
JPH0419819Y2 JPH0419819Y2 (ja) | 1992-05-06 |
Family
ID=12630639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985042245U Expired JPH0419819Y2 (ja) | 1985-03-23 | 1985-03-23 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4764931A (ja) |
EP (1) | EP0196200B1 (ja) |
JP (1) | JPH0419819Y2 (ja) |
KR (1) | KR920002914Y1 (ja) |
DE (1) | DE3680223D1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906839A (en) * | 1986-05-01 | 1990-03-06 | Pencom International Corp. | Hybrid surface emitting laser and detector |
JPS63124486A (ja) * | 1986-11-13 | 1988-05-27 | Mitsubishi Electric Corp | 半導体レ−ザの製造方法 |
US4905216A (en) * | 1986-12-04 | 1990-02-27 | Pencom International Corporation | Method for constructing an optical head by varying a hologram pattern |
US4945524A (en) * | 1987-04-15 | 1990-07-31 | Pioneer Electronic Corporation | Compact optical pickup apparatus for optical disk player |
US4999842A (en) * | 1989-03-01 | 1991-03-12 | At&T Bell Laboratories | Quantum well vertical cavity laser |
JPH02271586A (ja) * | 1989-04-12 | 1990-11-06 | Mitsubishi Electric Corp | 半導体レーザ装置 |
US4980549A (en) * | 1990-03-05 | 1990-12-25 | Eastman Kodak Company | Beam position sensor for a light beam scanner having emitter and detector disposed along the same optical axis |
ATE148285T1 (de) * | 1991-04-24 | 1997-02-15 | Siemens Ag | Optoelektronische sendevorrichtung |
US5293032A (en) * | 1992-02-10 | 1994-03-08 | Sydney Urshan | Digital data optical recording and playback system |
US5319182A (en) * | 1992-03-04 | 1994-06-07 | Welch Allyn, Inc. | Integrated solid state light emitting and detecting array and apparatus employing said array |
JPH0894938A (ja) * | 1994-09-21 | 1996-04-12 | Sony Corp | 共焦点顕微鏡並びに光記録再生装置 |
DE19742150C1 (de) * | 1997-09-24 | 1999-04-22 | Siemens Nixdorf Inf Syst | Verfahren zur Herstellung einer optischen Speicherplatte und zu deren Herstellung geeigneter CD-R-Plattenrohling |
US5903584A (en) * | 1998-01-05 | 1999-05-11 | Youngtek Electronics | Laser diode package |
JP2008004914A (ja) * | 2006-05-22 | 2008-01-10 | Toshiba Corp | 半導体レーザ装置 |
JP5753686B2 (ja) * | 2007-06-27 | 2015-07-22 | コーニンクレッカ フィリップス エヌ ヴェ | 光センサ・モジュール及びその製造方法 |
US9570648B2 (en) * | 2012-06-15 | 2017-02-14 | Intersil Americas LLC | Wafer level optical proximity sensors and systems including wafer level optical proximity sensors |
US9721837B2 (en) | 2015-04-16 | 2017-08-01 | Intersil Americas LLC | Wafer level optoelectronic device packages with crosstalk barriers and methods for making the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1073460A (en) * | 1964-07-31 | 1967-06-28 | Battelle Development Corp | Semiconductor devices |
GB1483849A (en) * | 1974-09-21 | 1977-08-24 | Nippon Electric Co | Semiconductor laser device equipped with a silicon heat sink |
DE2737345C2 (de) * | 1976-08-20 | 1991-07-25 | Canon K.K., Tokio/Tokyo | Halbleiterlaser-Vorrichtung mit einem Peltier-Element |
JPS6195591A (ja) * | 1984-10-16 | 1986-05-14 | Sony Corp | 半導体レ−ザ |
-
1985
- 1985-03-23 JP JP1985042245U patent/JPH0419819Y2/ja not_active Expired
-
1986
- 1986-03-10 KR KR2019860002759U patent/KR920002914Y1/ko not_active IP Right Cessation
- 1986-03-20 EP EP86302086A patent/EP0196200B1/en not_active Expired - Lifetime
- 1986-03-20 US US06/841,797 patent/US4764931A/en not_active Expired - Lifetime
- 1986-03-20 DE DE8686302086T patent/DE3680223D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US4764931A (en) | 1988-08-16 |
EP0196200A3 (en) | 1988-01-13 |
JPH0419819Y2 (ja) | 1992-05-06 |
DE3680223D1 (de) | 1991-08-22 |
KR920002914Y1 (ko) | 1992-05-08 |
KR860012475U (ko) | 1986-10-10 |
EP0196200B1 (en) | 1991-07-17 |
EP0196200A2 (en) | 1986-10-01 |