JPS61148850A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61148850A
JPS61148850A JP27080584A JP27080584A JPS61148850A JP S61148850 A JPS61148850 A JP S61148850A JP 27080584 A JP27080584 A JP 27080584A JP 27080584 A JP27080584 A JP 27080584A JP S61148850 A JPS61148850 A JP S61148850A
Authority
JP
Japan
Prior art keywords
package
leads
inspection
lead
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27080584A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0586861B2 (enrdf_load_stackoverflow
Inventor
Toshinori Hirashima
平島　利宣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP27080584A priority Critical patent/JPS61148850A/ja
Publication of JPS61148850A publication Critical patent/JPS61148850A/ja
Publication of JPH0586861B2 publication Critical patent/JPH0586861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP27080584A 1984-12-24 1984-12-24 半導体装置 Granted JPS61148850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27080584A JPS61148850A (ja) 1984-12-24 1984-12-24 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27080584A JPS61148850A (ja) 1984-12-24 1984-12-24 半導体装置

Publications (2)

Publication Number Publication Date
JPS61148850A true JPS61148850A (ja) 1986-07-07
JPH0586861B2 JPH0586861B2 (enrdf_load_stackoverflow) 1993-12-14

Family

ID=17491261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27080584A Granted JPS61148850A (ja) 1984-12-24 1984-12-24 半導体装置

Country Status (1)

Country Link
JP (1) JPS61148850A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516476A (en) * 1978-07-21 1980-02-05 Fujitsu Ltd Method of mounting semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5516476A (en) * 1978-07-21 1980-02-05 Fujitsu Ltd Method of mounting semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5521427A (en) * 1992-12-18 1996-05-28 Lsi Logic Corporation Printed wiring board mounted semiconductor device having leadframe with alignment feature
US5643835A (en) * 1992-12-18 1997-07-01 Lsi Logic Corporation Process for manufacturing and mounting a semiconductor device leadframe having alignment tabs

Also Published As

Publication number Publication date
JPH0586861B2 (enrdf_load_stackoverflow) 1993-12-14

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