JPS5516476A - Method of mounting semiconductor device - Google Patents
Method of mounting semiconductor deviceInfo
- Publication number
- JPS5516476A JPS5516476A JP8962778A JP8962778A JPS5516476A JP S5516476 A JPS5516476 A JP S5516476A JP 8962778 A JP8962778 A JP 8962778A JP 8962778 A JP8962778 A JP 8962778A JP S5516476 A JPS5516476 A JP S5516476A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting semiconductor
- mounting
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8962778A JPS5516476A (en) | 1978-07-21 | 1978-07-21 | Method of mounting semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8962778A JPS5516476A (en) | 1978-07-21 | 1978-07-21 | Method of mounting semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5516476A true JPS5516476A (en) | 1980-02-05 |
JPS5711517B2 JPS5711517B2 (en) | 1982-03-04 |
Family
ID=13975983
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8962778A Granted JPS5516476A (en) | 1978-07-21 | 1978-07-21 | Method of mounting semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5516476A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5632460U (en) * | 1979-08-18 | 1981-03-30 | ||
JPS5745995A (en) * | 1980-09-03 | 1982-03-16 | Canon Kk | Method and device for mounting electric circuit element |
JPS60254788A (en) * | 1984-05-31 | 1985-12-16 | 日立エーアイシー株式会社 | Method of producing printed circuit board |
JPS6139558A (en) * | 1984-07-31 | 1986-02-25 | Toshiba Glass Co Ltd | Semiconductor circuit substrate |
JPS61148850A (en) * | 1984-12-24 | 1986-07-07 | Hitachi Ltd | Semiconductor device |
JPS63217637A (en) * | 1987-03-06 | 1988-09-09 | Oki Electric Ind Co Ltd | Lead frame for semiconductor device |
-
1978
- 1978-07-21 JP JP8962778A patent/JPS5516476A/en active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5632460U (en) * | 1979-08-18 | 1981-03-30 | ||
JPS615819Y2 (en) * | 1979-08-18 | 1986-02-21 | ||
JPS5745995A (en) * | 1980-09-03 | 1982-03-16 | Canon Kk | Method and device for mounting electric circuit element |
JPS60254788A (en) * | 1984-05-31 | 1985-12-16 | 日立エーアイシー株式会社 | Method of producing printed circuit board |
JPS6139558A (en) * | 1984-07-31 | 1986-02-25 | Toshiba Glass Co Ltd | Semiconductor circuit substrate |
JPS61148850A (en) * | 1984-12-24 | 1986-07-07 | Hitachi Ltd | Semiconductor device |
JPH0586861B2 (en) * | 1984-12-24 | 1993-12-14 | Hitachi Ltd | |
JPS63217637A (en) * | 1987-03-06 | 1988-09-09 | Oki Electric Ind Co Ltd | Lead frame for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5711517B2 (en) | 1982-03-04 |
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