JPS6113398B2 - - Google Patents
Info
- Publication number
- JPS6113398B2 JPS6113398B2 JP4794881A JP4794881A JPS6113398B2 JP S6113398 B2 JPS6113398 B2 JP S6113398B2 JP 4794881 A JP4794881 A JP 4794881A JP 4794881 A JP4794881 A JP 4794881A JP S6113398 B2 JPS6113398 B2 JP S6113398B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- circuit board
- printed circuit
- opening hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 39
- 238000007598 dipping method Methods 0.000 claims description 18
- 239000011888 foil Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4794881A JPS57162492A (en) | 1981-03-31 | 1981-03-31 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4794881A JPS57162492A (en) | 1981-03-31 | 1981-03-31 | Printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57162492A JPS57162492A (en) | 1982-10-06 |
| JPS6113398B2 true JPS6113398B2 (de) | 1986-04-12 |
Family
ID=12789581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4794881A Granted JPS57162492A (en) | 1981-03-31 | 1981-03-31 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57162492A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585400U (ja) * | 1981-07-02 | 1983-01-13 | 三菱電機株式会社 | 電子部品の包装体 |
-
1981
- 1981-03-31 JP JP4794881A patent/JPS57162492A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57162492A (en) | 1982-10-06 |
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