JPS6113373B2 - - Google Patents
Info
- Publication number
- JPS6113373B2 JPS6113373B2 JP6037376A JP6037376A JPS6113373B2 JP S6113373 B2 JPS6113373 B2 JP S6113373B2 JP 6037376 A JP6037376 A JP 6037376A JP 6037376 A JP6037376 A JP 6037376A JP S6113373 B2 JPS6113373 B2 JP S6113373B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- heating
- tray
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 89
- 238000010438 heat treatment Methods 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 8
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 25
- 238000001259 photo etching Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037376A JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037376A JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52142972A JPS52142972A (en) | 1977-11-29 |
| JPS6113373B2 true JPS6113373B2 (enrdf_load_stackoverflow) | 1986-04-12 |
Family
ID=13140255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6037376A Granted JPS52142972A (en) | 1976-05-25 | 1976-05-25 | Semiconductor production device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52142972A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5522125U (enrdf_load_stackoverflow) * | 1978-07-31 | 1980-02-13 | ||
| JPS58176936A (ja) * | 1982-04-09 | 1983-10-17 | Fujitsu Ltd | 基板冷却方法 |
| JPS59175122A (ja) * | 1983-03-23 | 1984-10-03 | Nec Corp | 半導体基板塗布前処理装置 |
| JPS59211243A (ja) * | 1983-05-17 | 1984-11-30 | Toshiba Corp | 半導体基板処理装置 |
| JPH0234822Y2 (enrdf_load_stackoverflow) * | 1985-06-26 | 1990-09-19 |
-
1976
- 1976-05-25 JP JP6037376A patent/JPS52142972A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52142972A (en) | 1977-11-29 |
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