JPS61131869U - - Google Patents

Description

[Brief explanation of the drawing]

FIG. 1a is a schematic perspective view of the main parts of a hybrid integrated circuit device showing an embodiment of this invention, FIG. 1b is a schematic sectional view of a part thereof, and FIG. 2a is a concept of substrate processing of this invention. 2B is a schematic perspective view of the substrate of this invention, FIG. 3A is a schematic perspective view of a main part of a conventional hybrid integrated circuit device, and FIG. 3B is a schematic sectional view of a portion thereof. In the figure, 1 is a hybrid integrated circuit board, 2 is an electrode for chip mounting, 3 is an IC chip, 4 is a conductive pattern for connection, 5 is a microfine metal wire for connection, 6 is an adhesive, and 7 is an opening on the board. (square hole). Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Scope of utility model registration request] In a hybrid integrated circuit device in which an insulating substrate such as a ceramic substrate or a resin laminated substrate is used and a chip element is mounted on the insulating substrate, a base material in which a hole is formed for a mounting portion of the chip element, and a base material in which the hole is formed; The insulating substrate is formed by laminating base materials of the same size, electrodes and conductor patterns for mounting the chip element are formed on this substrate, and ultrafine metal wires are connected between the electrodes of the chip element and the conductor pattern. 1. A hybrid integrated circuit device characterized in that an electronic circuit is constructed by connecting the hybrid integrated circuit device using the following devices.