JPS63182572U - - Google Patents
Info
- Publication number
- JPS63182572U JPS63182572U JP7489487U JP7489487U JPS63182572U JP S63182572 U JPS63182572 U JP S63182572U JP 7489487 U JP7489487 U JP 7489487U JP 7489487 U JP7489487 U JP 7489487U JP S63182572 U JPS63182572 U JP S63182572U
- Authority
- JP
- Japan
- Prior art keywords
- metal
- circuit board
- based circuit
- exposed
- board according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Description
第１図ａ〜ｅはこの考案の一実施例の金属ベー
ス回路基板をその製造工程順に示す断面図、第２
図はこの考案の他の実施例の三層金属ベース回路
基板を示す断面図、第３図〜第５図は各々従来の
金属ベース回路基板を示す断面図である。
図において、１は金属ベース回路基板、１１は
金属露出部、１２は絶縁層、１５は導体パターン
、１６はボンデイングパツド、配線パターンは導
体パターン１５及びボンデイングパツド１６で構
成される。８は電子部品、この場合は半導体素子
である。なお、図中、同一符号は同一又は相当部
分を示す。
1A to 1E are cross-sectional views showing a metal base circuit board according to an embodiment of this invention in the order of its manufacturing process;
The figure is a cross-sectional view showing a three-layer metal base circuit board according to another embodiment of the present invention, and FIGS. 3 to 5 are cross-sectional views showing conventional metal base circuit boards. In the figure, 1 is a metal base circuit board, 11 is an exposed metal part, 12 is an insulating layer, 15 is a conductor pattern, 16 is a bonding pad, and the wiring pattern is composed of the conductor pattern 15 and the bonding pad 16. 8 is an electronic component, in this case a semiconductor element. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
出部を残して所定パターンに形成された絶縁層、
この絶縁層に形成された配線パターン、及び上記
金属露出部に塔載固着され上記配線パターンに電
気的に接続された発熱する電子部品を備えた金属
ベース回路基板。 (2) 金属露出部に金属ペーストを介して電子部
品を接着している実用新案登録請求の範囲第１項
記載の金属ベース回路基板。 (3) 金属露出部に絶縁性接着剤を介して電子部
品を接着している実用新案登録請求の範囲第１項
又は第２項記載の金属ベース回路基板。[Claims for Utility Model Registration] (1) A metal base plate, an insulating layer formed in a predetermined pattern with exposed metal parts on the metal base plate,
A metal-based circuit board comprising a wiring pattern formed on the insulating layer, and a heat-generating electronic component mounted and fixed on the exposed metal portion and electrically connected to the wiring pattern. (2) The metal-based circuit board according to claim 1, in which electronic components are bonded to the exposed metal portions via metal paste. (3) The metal-based circuit board according to claim 1 or 2 of the utility model registration claim, in which electronic components are bonded to the exposed metal portion via an insulating adhesive.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489487U JPS63182572U (en) | 1987-05-19 | 1987-05-19 | |
| US07/406,401 US4993148A (en) | 1987-05-19 | 1989-09-12 | Method of manufacturing a circuit board |
| US07/540,389 US5081562A (en) | 1987-05-19 | 1990-06-19 | Circuit board with high heat dissipations characteristic |
| US07/794,281 US5173844A (en) | 1987-05-19 | 1991-11-19 | Integrated circuit device having a metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7489487U JPS63182572U (en) | 1987-05-19 | 1987-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182572U true JPS63182572U (en) | 1988-11-24 |
Family
ID=30920537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7489487U Pending JPS63182572U (en) | 1987-05-19 | 1987-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182572U (en) |
-
1987
- 1987-05-19 JP JP7489487U patent/JPS63182572U/ja active Pending
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