JPS6266179U - - Google Patents
Info
- Publication number
- JPS6266179U JPS6266179U JP15837485U JP15837485U JPS6266179U JP S6266179 U JPS6266179 U JP S6266179U JP 15837485 U JP15837485 U JP 15837485U JP 15837485 U JP15837485 U JP 15837485U JP S6266179 U JPS6266179 U JP S6266179U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- conductive member
- connection structure
- elasticity
- silicone rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る電子部品の接
続構造の断面図、第２図は本考案の他の実施例に
係る電子部品の接続構造の断面図、第３図は本考
案のさらに他の実施例に係る電子部品の接続構造
の断面図、第４図は本考案のさらに他の実施例に
係る電子部品の接続構造の説明図である。
１……リード線、２……回路基板、３……ゴム
、４……端子、７ａ，７ｂ……端子、８……ＩＣ
チツプ、９……配線パターン。
FIG. 1 is a cross-sectional view of an electronic component connection structure according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of an electronic component connection structure according to another embodiment of the present invention, and FIG. 3 is a cross-sectional view of an electronic component connection structure according to another embodiment of the present invention. FIG. 4 is a cross-sectional view of a connection structure for electronic components according to still another embodiment of the present invention. FIG. 1...Lead wire, 2...Circuit board, 3...Rubber, 4...Terminal, 7a, 7b...Terminal, 8...IC
Chip, 9...Wiring pattern.
Claims (1)
の電気的接続が成されたことを特徴とする電子部
品の接続構造。 ２ 上記導電部材は液状シリコンゴムを加熱処理
したものであることを特徴とする実用新案登録請
求の範囲第１項記載の電子部品の接続構造。[Claims for Utility Model Registration] 1. A structure for electrically connecting electronic components, characterized in that the electrical connection between the electronic components is made by a conductive member having elasticity and adhesive properties. . 2. The connection structure for electronic components according to claim 1, wherein the conductive member is made of heat-treated liquid silicone rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15837485U JPS6266179U (en) | 1985-10-14 | 1985-10-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15837485U JPS6266179U (en) | 1985-10-14 | 1985-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6266179U true JPS6266179U (en) | 1987-04-24 |
Family
ID=31081801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15837485U Pending JPS6266179U (en) | 1985-10-14 | 1985-10-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6266179U (en) |
-
1985
- 1985-10-14 JP JP15837485U patent/JPS6266179U/ja active Pending
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