JPS6112034A - シリコン基材表面に酸化珪素被膜を形成させる方法 - Google Patents
シリコン基材表面に酸化珪素被膜を形成させる方法Info
- Publication number
- JPS6112034A JPS6112034A JP59132700A JP13270084A JPS6112034A JP S6112034 A JPS6112034 A JP S6112034A JP 59132700 A JP59132700 A JP 59132700A JP 13270084 A JP13270084 A JP 13270084A JP S6112034 A JPS6112034 A JP S6112034A
- Authority
- JP
- Japan
- Prior art keywords
- silicon oxide
- silicon
- film
- aqueous solution
- silicon substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P14/60—
Landscapes
- Silicon Compounds (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132700A JPS6112034A (ja) | 1984-06-27 | 1984-06-27 | シリコン基材表面に酸化珪素被膜を形成させる方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132700A JPS6112034A (ja) | 1984-06-27 | 1984-06-27 | シリコン基材表面に酸化珪素被膜を形成させる方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6112034A true JPS6112034A (ja) | 1986-01-20 |
| JPH0127574B2 JPH0127574B2 (OSRAM) | 1989-05-30 |
Family
ID=15087506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132700A Granted JPS6112034A (ja) | 1984-06-27 | 1984-06-27 | シリコン基材表面に酸化珪素被膜を形成させる方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112034A (OSRAM) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0465169A (ja) * | 1990-07-05 | 1992-03-02 | Toshiba Corp | E↑2prom装置 |
| JPH05259154A (ja) * | 1992-03-04 | 1993-10-08 | Nec Corp | 半導体装置の製造方法 |
| US5278104A (en) * | 1989-07-25 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor wafer carrier having a dust cover |
| US5468682A (en) * | 1993-12-21 | 1995-11-21 | Nec Corporation | Method of manufacturing semiconductor device using the abrasive |
| JP2007191380A (ja) * | 2005-12-21 | 2007-08-02 | National Institute Of Advanced Industrial & Technology | レーザ加工用シリカガラス |
| CN113321216A (zh) * | 2021-06-22 | 2021-08-31 | 中国地质科学院郑州矿产综合利用研究所 | 一种利用石英脉型钨废石制备高纯石英的方法 |
-
1984
- 1984-06-27 JP JP59132700A patent/JPS6112034A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5278104A (en) * | 1989-07-25 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor wafer carrier having a dust cover |
| JPH0465169A (ja) * | 1990-07-05 | 1992-03-02 | Toshiba Corp | E↑2prom装置 |
| JPH05259154A (ja) * | 1992-03-04 | 1993-10-08 | Nec Corp | 半導体装置の製造方法 |
| US5468682A (en) * | 1993-12-21 | 1995-11-21 | Nec Corporation | Method of manufacturing semiconductor device using the abrasive |
| JP2007191380A (ja) * | 2005-12-21 | 2007-08-02 | National Institute Of Advanced Industrial & Technology | レーザ加工用シリカガラス |
| CN113321216A (zh) * | 2021-06-22 | 2021-08-31 | 中国地质科学院郑州矿产综合利用研究所 | 一种利用石英脉型钨废石制备高纯石英的方法 |
| CN113321216B (zh) * | 2021-06-22 | 2023-09-22 | 中国地质科学院郑州矿产综合利用研究所 | 一种利用石英脉型钨废石制备高纯石英的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0127574B2 (OSRAM) | 1989-05-30 |
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