JPS61116856A - 半導体基板の分離方法 - Google Patents

半導体基板の分離方法

Info

Publication number
JPS61116856A
JPS61116856A JP59238936A JP23893684A JPS61116856A JP S61116856 A JPS61116856 A JP S61116856A JP 59238936 A JP59238936 A JP 59238936A JP 23893684 A JP23893684 A JP 23893684A JP S61116856 A JPS61116856 A JP S61116856A
Authority
JP
Japan
Prior art keywords
adhesive sheet
semiconductor substrate
fixed
sheet
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59238936A
Other languages
English (en)
Other versions
JPH0249540B2 (ja
Inventor
Masahiro Kobayashi
正弘 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP23893684A priority Critical patent/JPH0249540B2/ja
Publication of JPS61116856A publication Critical patent/JPS61116856A/ja
Publication of JPH0249540B2 publication Critical patent/JPH0249540B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半導体基板を個々のチップに切断後、粘着シ
ート上に均一な間隔に広げる方法に関するものである。
〔従来技術〕
従来、半導体基板を粘Ｎ７−トで分離して個々の素子間
を広げる場合、第２図（８）に示す工うに、半導体基板
１金粘着シート２に固層し、第２図（ａに示すように、
ダイサー上用いて半導体基板１′Ｊｔ間隔ａで切断し個
々のチップ３に分離する。次に、第２図（ｑに示す工う
に、粘着シート固定治具４で粘着シート２ｔ−固定し、
固定リング５上に乗せ粘着シート固定治具４ｔ−押し下
げるか固定リング５金持ち上げて間隔すに広げる。さら
に、第２図口に示す工うに、粘着シート固定リング６で
広げｔ粘着シート２ｔ−固定し、余分の粘着シートラ切
り取っている。
〔発明が解決しようとする問題点〕
しかしながら、粘着シート固定リング６の保持力が弱い
と、余分の粘着シートを切り取る時に切り始め念ところ
から粘着シート２が縮まる几めに半導体基板の個々のチ
ップの並びが不規則になるという欠点があった。また、
広げる量が少い時には固定リング５に粘着シート固定リ
ング６をかけ　−るすきまがなくなるという欠点があっ
た。
〔問題点を解決するための手段〕
本発明にＬれば、粘着シートに半導体基板を固定し、粘
Ｎ７−トｆ広げた後半導体基板全分割することによって
、半導体素子間を拡げることを特徴とする半導体基板の
分離力ｆ：を得る。
〔実施例〕
本発明を次に図面を参照して説明する。
ＷＩｚ図（５）に示す工うに半導体基板１を粘着シート
２に固着したものを、第１図面に示すように、粘着シー
ト固定治具４で粘着シート２を固定し、エキスバンド台
７上で粘着テープ２の半導体基板ｌｔ−固着していない
部分を延ばし、粘着シート固定フレーム８を粘着シート
２に固着し、余分の粘着シートを切り取る。
次に第１図日に示すようにダイサーの真空吸着台９に真
空吸着Ａで固定し、間隔ａで完全切断した後に第１図（
ｑに示すように真空吸Ｎｆ、開放するン　　　　　　　
ことに工り先に引き延ばし之粘清シート２の戻り応力で
チップが間隔すで均一に広げられる。
【図面の簡単な説明】
第１図（５）に、本発明の一実施例に係る粘着シートに
半導体基板を固着したまま引き延ばした状態の断面図、
第１図ＣＢ）は、本発明の一実施例に係る半導体基板の
完全切断した状態の断面図、第１図（ｑは、本発明の一
実施例に係る引き延ばした状態の断面図である。第２図
（Ａ）は従来の半導体基板全粘着テープに固着した状態
の断面図、第２図（Ｂ）は、従来の半導体基板をダイサ
ーで切断した状態の断面図、第２図（ｑは、従来の引き
延ばした状態の断面図、第２図口は従来の引き延ばした
後粘着シートを切断した状態の断面図である。 １・・・・・・半導体基板、２・・−・・・粘着シート
、３・・・・・チップ、４・・・・・・粘着シート固定
治具、５・・・・・・固定リング、６・・・・・・粘着
シート固定リング、７・・・・・・エキスバンド台、８
・・・・・・粘着シート固定フレーム、９・・・・・・
真空吸着台。

Claims (1)

    【特許請求の範囲】
  1. 半導体基板を粘着シートに張り付けてから粘着シートを
    引き延ばしておいて、前記半導体基板を切断することに
    より先に引き延ばした粘着シートの戻り応力を利用して
    半導体基板を個々のチップに分離することを特徴とする
    半導体基板の分離方法。
JP23893684A 1984-11-13 1984-11-13 Handotaikibannobunrihoho Expired - Lifetime JPH0249540B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23893684A JPH0249540B2 (ja) 1984-11-13 1984-11-13 Handotaikibannobunrihoho

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23893684A JPH0249540B2 (ja) 1984-11-13 1984-11-13 Handotaikibannobunrihoho

Publications (2)

Publication Number Publication Date
JPS61116856A true JPS61116856A (ja) 1986-06-04
JPH0249540B2 JPH0249540B2 (ja) 1990-10-30

Family

ID=17037477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23893684A Expired - Lifetime JPH0249540B2 (ja) 1984-11-13 1984-11-13 Handotaikibannobunrihoho

Country Status (1)

Country Link
JP (1) JPH0249540B2 (ja)

Also Published As

Publication number Publication date
JPH0249540B2 (ja) 1990-10-30

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