JPS6111462B2 - - Google Patents

Info

Publication number
JPS6111462B2
JPS6111462B2 JP4531778A JP4531778A JPS6111462B2 JP S6111462 B2 JPS6111462 B2 JP S6111462B2 JP 4531778 A JP4531778 A JP 4531778A JP 4531778 A JP4531778 A JP 4531778A JP S6111462 B2 JPS6111462 B2 JP S6111462B2
Authority
JP
Japan
Prior art keywords
resin
resin tablet
tablet
rollers
frequency heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4531778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS54137970A (en
Inventor
Hiroshi Koyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4531778A priority Critical patent/JPS54137970A/ja
Publication of JPS54137970A publication Critical patent/JPS54137970A/ja
Publication of JPS6111462B2 publication Critical patent/JPS6111462B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP4531778A 1978-04-19 1978-04-19 High-frequency standby heater and method for resin sealing Granted JPS54137970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4531778A JPS54137970A (en) 1978-04-19 1978-04-19 High-frequency standby heater and method for resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4531778A JPS54137970A (en) 1978-04-19 1978-04-19 High-frequency standby heater and method for resin sealing

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP20326285A Division JPS6176332A (ja) 1985-09-17 1985-09-17 高周波予備加熱装置

Publications (2)

Publication Number Publication Date
JPS54137970A JPS54137970A (en) 1979-10-26
JPS6111462B2 true JPS6111462B2 (US06650917-20031118-M00005.png) 1986-04-03

Family

ID=12715916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4531778A Granted JPS54137970A (en) 1978-04-19 1978-04-19 High-frequency standby heater and method for resin sealing

Country Status (1)

Country Link
JP (1) JPS54137970A (US06650917-20031118-M00005.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62151174U (US06650917-20031118-M00005.png) * 1986-03-18 1987-09-25

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3030685B2 (ja) * 1995-10-02 2000-04-10 栄次 丸子 プラスチックス電子加工法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62151174U (US06650917-20031118-M00005.png) * 1986-03-18 1987-09-25

Also Published As

Publication number Publication date
JPS54137970A (en) 1979-10-26

Similar Documents

Publication Publication Date Title
JPS6111462B2 (US06650917-20031118-M00005.png)
JPH05226396A (ja) 樹脂モールド型半導体装置の製造方法
US4504427A (en) Solder preform stabilization for lead frames
JPH0260500B2 (US06650917-20031118-M00005.png)
JPS59227131A (ja) 樹脂封止形半導体装置の製造方法およびこれに用いる封止装置
JPH0363500B2 (US06650917-20031118-M00005.png)
JPS6154636A (ja) 半導体樹脂封止用金型
JPS57181129A (en) Forming device molding package of semiconductors
JPS58222530A (ja) ペレツト付け方法
JPS60244512A (ja) 成形方法
JPH0411B2 (US06650917-20031118-M00005.png)
JPH01260837A (ja) 樹脂封止型半導体装置の製造方法
JPH04179242A (ja) 半導体素子の封止方法
JPH04326530A (ja) 半導体装置の樹脂封止装置
JP2610125B2 (ja) フレキシブル電気光学素子の製造方法
JPS58220715A (ja) ゴムまたは樹脂材料の射出成形方法
JPH066476Y2 (ja) タブレットレジンを加熱する▲高▼周波加熱装置
JPS61188875A (ja) 高周波誘導炉の屋根型電極
JPS60206607A (ja) タブレツト予熱方法およびタブレツト予熱装置
KR950000049Y1 (ko) 몰드다이
JPS6335422A (ja) 光学素子の製造方法
JPH048517A (ja) 半導体封止用レジンタブレットの加熱方法
JPH0360649B2 (US06650917-20031118-M00005.png)
JPS60113930A (ja) 半導体装置の樹脂封止成形方法
JPH06204273A (ja) 半導体樹脂封止装置