JPS6110980B2 - - Google Patents

Info

Publication number
JPS6110980B2
JPS6110980B2 JP52067045A JP6704577A JPS6110980B2 JP S6110980 B2 JPS6110980 B2 JP S6110980B2 JP 52067045 A JP52067045 A JP 52067045A JP 6704577 A JP6704577 A JP 6704577A JP S6110980 B2 JPS6110980 B2 JP S6110980B2
Authority
JP
Japan
Prior art keywords
substrate
semiconductor substrate
moat
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52067045A
Other languages
English (en)
Japanese (ja)
Other versions
JPS542069A (en
Inventor
Komei Yatsuno
Takayuki Wakui
Yasumichi Yasuda
Yutaka Misawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6704577A priority Critical patent/JPS542069A/ja
Publication of JPS542069A publication Critical patent/JPS542069A/ja
Publication of JPS6110980B2 publication Critical patent/JPS6110980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)
JP6704577A 1977-06-07 1977-06-07 Semiconductor device Granted JPS542069A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6704577A JPS542069A (en) 1977-06-07 1977-06-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6704577A JPS542069A (en) 1977-06-07 1977-06-07 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS542069A JPS542069A (en) 1979-01-09
JPS6110980B2 true JPS6110980B2 (enFirst) 1986-04-01

Family

ID=13333473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6704577A Granted JPS542069A (en) 1977-06-07 1977-06-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS542069A (enFirst)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722076U (ja) * 1993-09-16 1995-04-21 川崎重工業株式会社 ロータリピストンポンプ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57181133A (en) * 1981-04-30 1982-11-08 Nec Home Electronics Ltd Semiconductor device
JPS57202779A (en) * 1981-06-08 1982-12-11 Toshiba Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722076U (ja) * 1993-09-16 1995-04-21 川崎重工業株式会社 ロータリピストンポンプ

Also Published As

Publication number Publication date
JPS542069A (en) 1979-01-09

Similar Documents

Publication Publication Date Title
US3339274A (en) Top contact for surface protected semiconductor devices
US3591839A (en) Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
US4996586A (en) Crimp-type semiconductor device having non-alloy structure
CN108346700B (zh) 半导体装置及其制造方法
JP7149907B2 (ja) 半導体装置および半導体素子
US20070025684A1 (en) Connection Structure Semiconductor Chip and Electronic Component Including the Connection Structure and Methods for Producing the Connection Structure
US7368815B2 (en) Semiconductor device which prevents light from entering therein
JP2956786B2 (ja) 合成ハイブリッド半導体ストラクチャ
WO2016189643A1 (ja) 半導体装置の製造方法
JPS6110980B2 (enFirst)
JP3261912B2 (ja) バンプ付き半導体装置およびその製造方法
JP2687017B2 (ja) ショットキバリア半導体装置
US3292056A (en) Thermally stable semiconductor device with an intermediate plate for preventing flashover
JP2005019798A (ja) モールド型半導体装置及びその製造方法
JP2017011176A (ja) 半導体装置および半導体装置の製造方法
US4171528A (en) Solderable zener diode
US4609936A (en) Semiconductor chip with direct-bonded external leadframe
US10950566B2 (en) Semiconductor device and method for manufacturing the semiconductor device
JPH05218454A (ja) 半導体装置
US3068383A (en) Electric semiconductor device
US3353073A (en) Magnesium-aluminum alloy contacts for semiconductor devices
JP2010056228A (ja) 半導体装置およびその製造方法
JP2003273357A (ja) 半導体装置およびその製造方法
JP2001118957A (ja) 半導体装置
JPS6325507B2 (enFirst)