JPS61105841A - 露光装置及び露光方法 - Google Patents

露光装置及び露光方法

Info

Publication number
JPS61105841A
JPS61105841A JP59227504A JP22750484A JPS61105841A JP S61105841 A JPS61105841 A JP S61105841A JP 59227504 A JP59227504 A JP 59227504A JP 22750484 A JP22750484 A JP 22750484A JP S61105841 A JPS61105841 A JP S61105841A
Authority
JP
Japan
Prior art keywords
vacuum
substrate
flatness
vacuum chuck
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59227504A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582728B2 (enrdf_load_stackoverflow
Inventor
Mutsumi Matsuo
睦 松尾
Hiroyuki Oshima
弘之 大島
Satoshi Takenaka
敏 竹中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP59227504A priority Critical patent/JPS61105841A/ja
Publication of JPS61105841A publication Critical patent/JPS61105841A/ja
Publication of JPH0582728B2 publication Critical patent/JPH0582728B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP59227504A 1984-10-29 1984-10-29 露光装置及び露光方法 Granted JPS61105841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59227504A JPS61105841A (ja) 1984-10-29 1984-10-29 露光装置及び露光方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59227504A JPS61105841A (ja) 1984-10-29 1984-10-29 露光装置及び露光方法

Publications (2)

Publication Number Publication Date
JPS61105841A true JPS61105841A (ja) 1986-05-23
JPH0582728B2 JPH0582728B2 (enrdf_load_stackoverflow) 1993-11-22

Family

ID=16861927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59227504A Granted JPS61105841A (ja) 1984-10-29 1984-10-29 露光装置及び露光方法

Country Status (1)

Country Link
JP (1) JPS61105841A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0272622A (ja) * 1988-09-07 1990-03-12 Teru Kyushu Kk Ｌｃｄ基板のガス処理装置
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
WO2015169616A1 (en) * 2014-05-06 2015-11-12 Asml Netherlands B.V. Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
CN110774077A (zh) * 2019-10-21 2020-02-11 王春宏 一种晶圆加工减薄机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
JPS5867026A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ステップアンドリピート方式の露光装置
JPS5917247A (ja) * 1982-07-21 1984-01-28 Hitachi Ltd 露光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57204547A (en) * 1981-06-12 1982-12-15 Hitachi Ltd Exposing method
JPS5867026A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ステップアンドリピート方式の露光装置
JPS5917247A (ja) * 1982-07-21 1984-01-28 Hitachi Ltd 露光装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0272622A (ja) * 1988-09-07 1990-03-12 Teru Kyushu Kk Ｌｃｄ基板のガス処理装置
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
WO2015169616A1 (en) * 2014-05-06 2015-11-12 Asml Netherlands B.V. Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
CN106255924A (zh) * 2014-05-06 2016-12-21 Asml荷兰有限公司 衬底支座、用于在衬底支撑位置上加载衬底的方法、光刻设备和器件制造方法
US10656536B2 (en) 2014-05-06 2020-05-19 Asml Netherlands B.V. Substrate support, method for loading a substrate on a substrate support location, lithographic apparatus and device manufacturing method
CN110774077A (zh) * 2019-10-21 2020-02-11 王春宏 一种晶圆加工减薄机
CN110774077B (zh) * 2019-10-21 2021-08-10 无锡芯坤电子科技有限公司 一种晶圆加工减薄机

Also Published As

Publication number Publication date
JPH0582728B2 (enrdf_load_stackoverflow) 1993-11-22

Similar Documents

Publication Publication Date Title
KR960001173B1 (ko) 레지스트 처리장치
US4213698A (en) Apparatus and method for holding and planarizing thin workpieces
CN103531511B (zh) 吸盘及使用该吸盘的承片台和硅片吸附方法
USRE31053E (en) Apparatus and method for holding and planarizing thin workpieces
US11302566B2 (en) Wafer table with dynamic support pins
WO2019231518A1 (en) Multi-substrate processing on digital lithography systems
US5222293A (en) System for placing an object on a carrier and method
JPS6015147B2 (ja) 表裏両外面を有する基板ウェファの保持および平面化方法
JPS61105841A (ja) 露光装置及び露光方法
JPH01319965A (ja) 基板の吸着装置
JPH03259520A (ja) 回転研磨装置
JPH03101247A (ja) 処理装置
JPH0147007B2 (enrdf_load_stackoverflow)
CN208368480U (zh) 晶片侧面打码读码存储一体机
CN218203017U (zh) 一种量子芯片加工工装
JPH03297125A (ja) パターン転写装置
JPH01231345A (ja) ウエハチヤツク
JPH0338835Y2 (enrdf_load_stackoverflow)
JPH0513308A (ja) 半導体装置の製造方法
JPS6353689B2 (enrdf_load_stackoverflow)
JPH01241825A (ja) 半導体装置の製造方法
JPS58160056A (ja) 研摩装置
JPS60224224A (ja) マスクアライメント方法
JPS59161820A (ja) マスク合せ装置
JPH08320389A (ja) 測定ステージ

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term