JPS611033A - ボンデイングの方法 - Google Patents
ボンデイングの方法Info
- Publication number
- JPS611033A JPS611033A JP60019686A JP1968685A JPS611033A JP S611033 A JPS611033 A JP S611033A JP 60019686 A JP60019686 A JP 60019686A JP 1968685 A JP1968685 A JP 1968685A JP S611033 A JPS611033 A JP S611033A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode
- tool
- distance
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000033001 locomotion Effects 0.000 abstract description 3
- 238000010276 construction Methods 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 244000292604 Salvia columbariae Species 0.000 description 2
- 235000012377 Salvia columbariae var. columbariae Nutrition 0.000 description 2
- 235000001498 Salvia hispanica Nutrition 0.000 description 2
- 235000014167 chia Nutrition 0.000 description 2
- 241000282693 Cercopithecidae Species 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60019686A JPS611033A (ja) | 1985-02-04 | 1985-02-04 | ボンデイングの方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60019686A JPS611033A (ja) | 1985-02-04 | 1985-02-04 | ボンデイングの方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12673676A Division JPS5351968A (en) | 1976-10-21 | 1976-10-21 | Bonding unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS611033A true JPS611033A (ja) | 1986-01-07 |
| JPS6120138B2 JPS6120138B2 (enrdf_load_stackoverflow) | 1986-05-21 |
Family
ID=12006118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60019686A Granted JPS611033A (ja) | 1985-02-04 | 1985-02-04 | ボンデイングの方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS611033A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100390863B1 (ko) * | 2000-10-16 | 2003-07-10 | 이국재 | 잉크카트리지용 흡착기 및 잉크카트리지의 리필장치 |
-
1985
- 1985-02-04 JP JP60019686A patent/JPS611033A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120138B2 (enrdf_load_stackoverflow) | 1986-05-21 |
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