JPS6120138B2 - - Google Patents

Info

Publication number
JPS6120138B2
JPS6120138B2 JP60019686A JP1968685A JPS6120138B2 JP S6120138 B2 JPS6120138 B2 JP S6120138B2 JP 60019686 A JP60019686 A JP 60019686A JP 1968685 A JP1968685 A JP 1968685A JP S6120138 B2 JPS6120138 B2 JP S6120138B2
Authority
JP
Japan
Prior art keywords
chip
electrode
bonding
tool
positioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60019686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS611033A (ja
Inventor
Katsuyuki Kawase
Juji Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Nippon Electric Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP60019686A priority Critical patent/JPS611033A/ja
Publication of JPS611033A publication Critical patent/JPS611033A/ja
Publication of JPS6120138B2 publication Critical patent/JPS6120138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP60019686A 1985-02-04 1985-02-04 ボンデイングの方法 Granted JPS611033A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60019686A JPS611033A (ja) 1985-02-04 1985-02-04 ボンデイングの方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60019686A JPS611033A (ja) 1985-02-04 1985-02-04 ボンデイングの方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12673676A Division JPS5351968A (en) 1976-10-21 1976-10-21 Bonding unit

Publications (2)

Publication Number Publication Date
JPS611033A JPS611033A (ja) 1986-01-07
JPS6120138B2 true JPS6120138B2 (enrdf_load_stackoverflow) 1986-05-21

Family

ID=12006118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60019686A Granted JPS611033A (ja) 1985-02-04 1985-02-04 ボンデイングの方法

Country Status (1)

Country Link
JP (1) JPS611033A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100390863B1 (ko) * 2000-10-16 2003-07-10 이국재 잉크카트리지용 흡착기 및 잉크카트리지의 리필장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100390863B1 (ko) * 2000-10-16 2003-07-10 이국재 잉크카트리지용 흡착기 및 잉크카트리지의 리필장치

Also Published As

Publication number Publication date
JPS611033A (ja) 1986-01-07

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