JPS61101062A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS61101062A
JPS61101062A JP59222181A JP22218184A JPS61101062A JP S61101062 A JPS61101062 A JP S61101062A JP 59222181 A JP59222181 A JP 59222181A JP 22218184 A JP22218184 A JP 22218184A JP S61101062 A JPS61101062 A JP S61101062A
Authority
JP
Japan
Prior art keywords
lead
leads
pitch
semiconductor device
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59222181A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0471340B2 (cg-RX-API-DMAC10.html
Inventor
Shinya Funayama
舩山　伸也
Akira Suzuki
明 鈴木
Hajime Murakami
元 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP59222181A priority Critical patent/JPS61101062A/ja
Publication of JPS61101062A publication Critical patent/JPS61101062A/ja
Publication of JPH0471340B2 publication Critical patent/JPH0471340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/421—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59222181A 1984-10-24 1984-10-24 半導体装置の製造方法 Granted JPS61101062A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59222181A JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59222181A JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61101062A true JPS61101062A (ja) 1986-05-19
JPH0471340B2 JPH0471340B2 (cg-RX-API-DMAC10.html) 1992-11-13

Family

ID=16778426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59222181A Granted JPS61101062A (ja) 1984-10-24 1984-10-24 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS61101062A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625652U (cg-RX-API-DMAC10.html) * 1985-06-26 1987-01-14
US12431421B2 (en) 2021-12-07 2025-09-30 Mitsubishi Electric Corporation Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756532U (cg-RX-API-DMAC10.html) * 1980-09-22 1982-04-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756532U (cg-RX-API-DMAC10.html) * 1980-09-22 1982-04-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS625652U (cg-RX-API-DMAC10.html) * 1985-06-26 1987-01-14
US12431421B2 (en) 2021-12-07 2025-09-30 Mitsubishi Electric Corporation Semiconductor device

Also Published As

Publication number Publication date
JPH0471340B2 (cg-RX-API-DMAC10.html) 1992-11-13

Similar Documents

Publication Publication Date Title
US3431092A (en) Lead frame members for semiconductor devices
JP2927660B2 (ja) 樹脂封止型半導体装置の製造方法
US5837567A (en) Lead frame and semiconductor device
JP2003282809A (ja) 半導体装置およびその製造方法
EP0086724A2 (en) Integrated circuit lead frame with improved power dissipation
US6891254B2 (en) Semiconductor device with protrusions
JPS61101062A (ja) 半導体装置の製造方法
JPH0254665B2 (cg-RX-API-DMAC10.html)
JP7571712B2 (ja) 半導体装置及びその製造方法
JP3127104B2 (ja) 樹脂封止型半導体装置の封止用金型およびこれを用いた製造方法
CA1292326C (en) Alignment of leads for ceramic integrated circuit packages
JPS6194349A (ja) 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム
JP2601033B2 (ja) 樹脂封止型半導体装置およびその製造方法
JP2708342B2 (ja) リードフレーム
JPH0242751A (ja) 樹脂封止形半導体装置の製造方法
JP2917556B2 (ja) 絶縁物封止型電子部品の製造方法
JPH1027870A (ja) 半導体装置およびその製造方法
KR0152577B1 (ko) 각형 위치 정렬 핀을 이용한 외부리드의 언더 컷 방지 방법
JPH10144821A (ja) 樹脂パッケージ型半導体装置およびその製造方法
WO2022259395A1 (ja) 半導体製造装置および半導体装置の製造方法
JPH05259357A (ja) フラットパッケージ半導体装置用リードフレーム
JPH02288258A (ja) 半導体装置およびその製造方法ならびにモールド型
JPH05308108A (ja) 電力半導体装置の製造方法
JP2000114447A (ja) 半導体装置製造用のリードフレーム、およびこれにより製造された半導体装置
JPH01315147A (ja) 樹脂封止形半導体装置の製造方法