JPS60943U - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS60943U
JPS60943U JP9264183U JP9264183U JPS60943U JP S60943 U JPS60943 U JP S60943U JP 9264183 U JP9264183 U JP 9264183U JP 9264183 U JP9264183 U JP 9264183U JP S60943 U JPS60943 U JP S60943U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
insulating substrate
semiconductor elements
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9264183U
Other languages
English (en)
Inventor
内田　治男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP9264183U priority Critical patent/JPS60943U/ja
Publication of JPS60943U publication Critical patent/JPS60943U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の集積回路装置の断面図、第２図、第３図
ａ　’−ｃは各々本考案に係る一実施例の断面図及び製
造工程順の要部断面図を示す。 なお図において、１．７・・・・・・集積回路装置、２
・・・・・・ケース、３・・・・・・ホンディングワイ
ヤ、４．９・・・・・・キャップ、５．１０・・・・・
・配線、６・・・・・田−材、８・・・・・・絶縁基板
、１１．１２・・・・・・ｎ型又はｐ型シリコン、１３
・・・・・・上部配線、１４・・・・・・素子領域であ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板上に半導体素子を形成してなる集積回路装置に
    おいて、該絶縁基板の表面より裏面へ導通孔により配線
    を行ない、該配線と該絶縁基板表面に形成された半導体
    素子相互を結ぶ配線とを接続した構造を有することを特
    徴とする集積回路装置。
JP9264183U 1983-06-16 1983-06-16 集積回路装置 Pending JPS60943U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9264183U JPS60943U (ja) 1983-06-16 1983-06-16 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9264183U JPS60943U (ja) 1983-06-16 1983-06-16 集積回路装置

Publications (1)

Publication Number Publication Date
JPS60943U true JPS60943U (ja) 1985-01-07

Family

ID=30222950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9264183U Pending JPS60943U (ja) 1983-06-16 1983-06-16 集積回路装置

Country Status (1)

Country Link
JP (1) JPS60943U (ja)

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