JPS6092649A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6092649A
JPS6092649A JP58202054A JP20205483A JPS6092649A JP S6092649 A JPS6092649 A JP S6092649A JP 58202054 A JP58202054 A JP 58202054A JP 20205483 A JP20205483 A JP 20205483A JP S6092649 A JPS6092649 A JP S6092649A
Authority
JP
Japan
Prior art keywords
semiconductor element
another member
members
electrode pattern
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58202054A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0213936B2 (enExample
Inventor
Yoshihiro Hisa
義浩 久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58202054A priority Critical patent/JPS6092649A/ja
Publication of JPS6092649A publication Critical patent/JPS6092649A/ja
Publication of JPH0213936B2 publication Critical patent/JPH0213936B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/093—
    • H10W70/60—
    • H10W72/874—
    • H10W90/00—
    • H10W90/10—

Landscapes

  • Wire Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
JP58202054A 1983-10-26 1983-10-26 半導体装置 Granted JPS6092649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58202054A JPS6092649A (ja) 1983-10-26 1983-10-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58202054A JPS6092649A (ja) 1983-10-26 1983-10-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS6092649A true JPS6092649A (ja) 1985-05-24
JPH0213936B2 JPH0213936B2 (enExample) 1990-04-05

Family

ID=16451169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58202054A Granted JPS6092649A (ja) 1983-10-26 1983-10-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS6092649A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427349U (enExample) * 1990-06-25 1992-03-04
JPH0439629U (enExample) * 1990-07-31 1992-04-03

Also Published As

Publication number Publication date
JPH0213936B2 (enExample) 1990-04-05

Similar Documents

Publication Publication Date Title
KR890015358A (ko) 반도체기판 및 그 제조방법
JPS5896760A (ja) 半導体装置の製法
KR930024140A (ko) 반도체장치 및 그 제조방법
US3960561A (en) Method for making electrical lead frame devices
US4843035A (en) Method for connecting elements of a circuit device
JPH01266786A (ja) 混成集積回路の製造方法
JPS6092649A (ja) 半導体装置
JP2005501420A (ja) 透過性基板上のカラー画像センサ及びその製造方法
JPS6354740A (ja) 集積回路基板の製造方法
JPH03101128A (ja) 半導体チップの製造方法
JPH0758112A (ja) 半導体装置
JPH11204519A (ja) 半導体装置及びその製造方法
DE60123709D1 (de) Herstellungsverfahren einer hybriden integrierten schaltung mit einem halbleiterbauelement und einem piezoelektrischen filter
JPS611038A (ja) 半導体装置の製造方法
JP2862510B2 (ja) シャドーマスク（ｓｈａｄｏｗ ｍａｓｋ）を用いたバンプ（ｂｕｍｐ）の形成方法
JPS6041861B2 (ja) 半導体装置
JPH05109679A (ja) 半導体装置の製造方法
JPS63150931A (ja) 半導体装置
JPH0422131A (ja) 半導体装置の製造方法
JPS586951B2 (ja) 電子回路装置
JPH11204576A (ja) 半導体配線の構造
JP2003109987A (ja) フリップチップ実装基板および半導体装置
JP2674411B2 (ja) 半導体装置の製造方法
JPS6381095A (ja) Ｉｃチツプの実装方法
JPS587073B2 (ja) カゴウブツハンドウタイソウチノセイサクホウ