JPS6088542U - ゲ−トリム−バル装置 - Google Patents

ゲ−トリム−バル装置

Info

Publication number
JPS6088542U
JPS6088542U JP18074183U JP18074183U JPS6088542U JP S6088542 U JPS6088542 U JP S6088542U JP 18074183 U JP18074183 U JP 18074183U JP 18074183 U JP18074183 U JP 18074183U JP S6088542 U JPS6088542 U JP S6088542U
Authority
JP
Japan
Prior art keywords
lead frame
cold slug
semiconductor lead
support engagement
gate trim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18074183U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244528Y2 (enrdf_load_stackoverflow
Inventor
道男 長田
剛 天川
Original Assignee
有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 有限会社ティ・アンド・ケイ・インターナショナル研究所 filed Critical 有限会社ティ・アンド・ケイ・インターナショナル研究所
Priority to JP18074183U priority Critical patent/JPS6088542U/ja
Publication of JPS6088542U publication Critical patent/JPS6088542U/ja
Application granted granted Critical
Publication of JPS6244528Y2 publication Critical patent/JPS6244528Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP18074183U 1983-11-21 1983-11-21 ゲ−トリム−バル装置 Granted JPS6088542U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18074183U JPS6088542U (ja) 1983-11-21 1983-11-21 ゲ−トリム−バル装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18074183U JPS6088542U (ja) 1983-11-21 1983-11-21 ゲ−トリム−バル装置

Publications (2)

Publication Number Publication Date
JPS6088542U true JPS6088542U (ja) 1985-06-18
JPS6244528Y2 JPS6244528Y2 (enrdf_load_stackoverflow) 1987-11-25

Family

ID=30391818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18074183U Granted JPS6088542U (ja) 1983-11-21 1983-11-21 ゲ−トリム−バル装置

Country Status (1)

Country Link
JP (1) JPS6088542U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01258926A (ja) * 1988-04-08 1989-10-16 Mitsubishi Metal Corp カル切断装置
JPH07156215A (ja) * 1993-12-10 1995-06-20 Nec Corp 樹脂封止半導体装置用ゲート分離装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01258926A (ja) * 1988-04-08 1989-10-16 Mitsubishi Metal Corp カル切断装置
JPH07156215A (ja) * 1993-12-10 1995-06-20 Nec Corp 樹脂封止半導体装置用ゲート分離装置

Also Published As

Publication number Publication date
JPS6244528Y2 (enrdf_load_stackoverflow) 1987-11-25

Similar Documents

Publication Publication Date Title
JPS6088542U (ja) ゲ−トリム−バル装置
JPS60169757U (ja) デイスククランプ装置
JPS5967944U (ja) 樹脂封止型半導体装置
JPS58440U (ja) プラスチツクパツケ−ジ
JPS59164251U (ja) 半導体装置用リ−ドフレ−ム
JPS58140647U (ja) リ−ドフレ−ム
JPS5844848U (ja) 半導体ウエハ−固定用治具
JPS59124046U (ja) ZnSe研磨用治具
JPS59180922U (ja) チェンジレバーのブーツ取付構造
JPS58189543U (ja) モ−ルド型半導体装置
JPS6117750U (ja) 半導体装置用フレ−ム
JPS5834742U (ja) 樹脂封止形半導体装置の放熱構造
JPS59127246U (ja) 樹脂封止型半導体装置
JPS6113939U (ja) 樹脂絶縁型半導体素子
JPS5969074U (ja) フエンダ−のバツフア−取付装置
JPS6134738U (ja) 樹脂モ−ルド型半導体装置
JPS58176580U (ja) 平面対向型コアレスモータ
JPS6025145U (ja) 半導体装置
JPS6122342U (ja) 半導体装置
JPS59109149U (ja) 半導体用パツケ−ジ
JPS59181297U (ja) ポンプのメカニカルシール装置
JPS60193851U (ja) ステアリングホイ−ルパツド取付構造
JPS5992494U (ja) 磁気デイスク装置
JPS60151143U (ja) 半導体用リ−ドフレ−ム
JPS5961539U (ja) トランジスタの取付構造