JPS608706A - ボンディングワイヤ形状検査装置 - Google Patents

ボンディングワイヤ形状検査装置

Info

Publication number
JPS608706A
JPS608706A JP58115871A JP11587183A JPS608706A JP S608706 A JPS608706 A JP S608706A JP 58115871 A JP58115871 A JP 58115871A JP 11587183 A JP11587183 A JP 11587183A JP S608706 A JPS608706 A JP S608706A
Authority
JP
Japan
Prior art keywords
wire
image
inspection
plane
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58115871A
Other languages
English (en)
Japanese (ja)
Other versions
JPH047448B2 (enrdf_load_stackoverflow
Inventor
Hiroyuki Tsukahara
博之 塚原
Masahito Nakajima
雅人 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58115871A priority Critical patent/JPS608706A/ja
Publication of JPS608706A publication Critical patent/JPS608706A/ja
Publication of JPH047448B2 publication Critical patent/JPH047448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP58115871A 1983-06-29 1983-06-29 ボンディングワイヤ形状検査装置 Granted JPS608706A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58115871A JPS608706A (ja) 1983-06-29 1983-06-29 ボンディングワイヤ形状検査装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58115871A JPS608706A (ja) 1983-06-29 1983-06-29 ボンディングワイヤ形状検査装置

Publications (2)

Publication Number Publication Date
JPS608706A true JPS608706A (ja) 1985-01-17
JPH047448B2 JPH047448B2 (enrdf_load_stackoverflow) 1992-02-12

Family

ID=14673217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58115871A Granted JPS608706A (ja) 1983-06-29 1983-06-29 ボンディングワイヤ形状検査装置

Country Status (1)

Country Link
JP (1) JPS608706A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61277005A (ja) * 1985-05-31 1986-12-08 Nippon Denso Co Ltd チップ部品の実装検査装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102457676A (zh) * 2010-10-29 2012-05-16 华晶科技股份有限公司 影像处理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52133241A (en) * 1976-04-30 1977-11-08 Hitachi Shipbuilding Eng Co Shape detecting apparatus
JPS5537982A (en) * 1978-09-11 1980-03-17 Ishikawajima Harima Heavy Ind Co Ltd Solid-shape detector for characteristic test of deformation of curved-surface body
JPS5662508U (enrdf_load_stackoverflow) * 1979-10-22 1981-05-27
JPS57149905A (en) * 1981-03-11 1982-09-16 Fujitsu Ltd Pattern inspecting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52133241A (en) * 1976-04-30 1977-11-08 Hitachi Shipbuilding Eng Co Shape detecting apparatus
JPS5537982A (en) * 1978-09-11 1980-03-17 Ishikawajima Harima Heavy Ind Co Ltd Solid-shape detector for characteristic test of deformation of curved-surface body
JPS5662508U (enrdf_load_stackoverflow) * 1979-10-22 1981-05-27
JPS57149905A (en) * 1981-03-11 1982-09-16 Fujitsu Ltd Pattern inspecting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61277005A (ja) * 1985-05-31 1986-12-08 Nippon Denso Co Ltd チップ部品の実装検査装置

Also Published As

Publication number Publication date
JPH047448B2 (enrdf_load_stackoverflow) 1992-02-12

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