JPS6086894A - 印刷回路用銅箔とその製造方法 - Google Patents

印刷回路用銅箔とその製造方法

Info

Publication number
JPS6086894A
JPS6086894A JP19437983A JP19437983A JPS6086894A JP S6086894 A JPS6086894 A JP S6086894A JP 19437983 A JP19437983 A JP 19437983A JP 19437983 A JP19437983 A JP 19437983A JP S6086894 A JPS6086894 A JP S6086894A
Authority
JP
Japan
Prior art keywords
copper foil
layer
phosphorus
zinc
containing nickel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19437983A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0259639B2 (fr
Inventor
中津川　広司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Circuit Foil Co Ltd
Original Assignee
Furukawa Circuit Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Circuit Foil Co Ltd filed Critical Furukawa Circuit Foil Co Ltd
Priority to JP19437983A priority Critical patent/JPS6086894A/ja
Publication of JPS6086894A publication Critical patent/JPS6086894A/ja
Publication of JPH0259639B2 publication Critical patent/JPH0259639B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP19437983A 1983-10-19 1983-10-19 印刷回路用銅箔とその製造方法 Granted JPS6086894A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19437983A JPS6086894A (ja) 1983-10-19 1983-10-19 印刷回路用銅箔とその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19437983A JPS6086894A (ja) 1983-10-19 1983-10-19 印刷回路用銅箔とその製造方法

Publications (2)

Publication Number Publication Date
JPS6086894A true JPS6086894A (ja) 1985-05-16
JPH0259639B2 JPH0259639B2 (fr) 1990-12-13

Family

ID=16323614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19437983A Granted JPS6086894A (ja) 1983-10-19 1983-10-19 印刷回路用銅箔とその製造方法

Country Status (1)

Country Link
JP (1) JPS6086894A (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496393A (ja) * 1990-08-14 1992-03-27 Nikko Kyodo Co Ltd 印刷回路用銅箔の処理方法
JP2009286071A (ja) * 2008-05-30 2009-12-10 Mitsui Mining & Smelting Co Ltd 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板
JP2012207285A (ja) * 2011-03-30 2012-10-25 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法、該表面処理銅箔を用いた銅張積層基板及びその製造方法、並びにプリント配線基板
JP2017220612A (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04133738U (ja) * 1991-06-04 1992-12-11 株式会社丸伸 衣服吊持回転装置
JPH0624541U (ja) * 1992-08-19 1994-04-05 株式会社ダイドー 回転衣類収納装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56155592A (en) * 1980-04-03 1981-12-01 Furukawa Circuit Foil Copper foil for printed circuit and method of manufacturing same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496393A (ja) * 1990-08-14 1992-03-27 Nikko Kyodo Co Ltd 印刷回路用銅箔の処理方法
JPH0654829B2 (ja) * 1990-08-14 1994-07-20 株式会社ジャパンエナジー 印刷回路用銅箔の処理方法
JP2009286071A (ja) * 2008-05-30 2009-12-10 Mitsui Mining & Smelting Co Ltd 銅張積層板、その銅張積層板製造に用いる表面処理銅箔及びその銅張積層板を用いて得られるプリント配線板
JP2012207285A (ja) * 2011-03-30 2012-10-25 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法、該表面処理銅箔を用いた銅張積層基板及びその製造方法、並びにプリント配線基板
JP2017220612A (ja) * 2016-06-09 2017-12-14 株式会社デンソー 多層基板の製造方法
WO2017212934A1 (fr) * 2016-06-09 2017-12-14 株式会社デンソー Procédé de fabrication d'un substrat en céramique multicouche
CN113316329A (zh) * 2016-06-09 2021-08-27 株式会社村田制作所 多层基板的制造方法
US11160174B2 (en) 2016-06-09 2021-10-26 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer substrate
US11856712B2 (en) 2016-06-09 2023-12-26 Murata Manufacturing Co., Ltd. Method of manufacturing multilayer substrate

Also Published As

Publication number Publication date
JPH0259639B2 (fr) 1990-12-13

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