JPS6085548A - 集積回路装置 - Google Patents

集積回路装置

Info

Publication number
JPS6085548A
JPS6085548A JP58193798A JP19379883A JPS6085548A JP S6085548 A JPS6085548 A JP S6085548A JP 58193798 A JP58193798 A JP 58193798A JP 19379883 A JP19379883 A JP 19379883A JP S6085548 A JPS6085548 A JP S6085548A
Authority
JP
Japan
Prior art keywords
film
integrated circuit
circuit device
si3n4
sio2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58193798A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219625B2 (https=
Inventor
Kuniyuki Hamano
浜野　邦幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58193798A priority Critical patent/JPS6085548A/ja
Publication of JPS6085548A publication Critical patent/JPS6085548A/ja
Publication of JPH0219625B2 publication Critical patent/JPH0219625B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Wire Bonding (AREA)
JP58193798A 1983-10-17 1983-10-17 集積回路装置 Granted JPS6085548A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58193798A JPS6085548A (ja) 1983-10-17 1983-10-17 集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58193798A JPS6085548A (ja) 1983-10-17 1983-10-17 集積回路装置

Publications (2)

Publication Number Publication Date
JPS6085548A true JPS6085548A (ja) 1985-05-15
JPH0219625B2 JPH0219625B2 (https=) 1990-05-02

Family

ID=16313950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58193798A Granted JPS6085548A (ja) 1983-10-17 1983-10-17 集積回路装置

Country Status (1)

Country Link
JP (1) JPS6085548A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6411337A (en) * 1987-07-03 1989-01-13 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6411337A (en) * 1987-07-03 1989-01-13 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPH0219625B2 (https=) 1990-05-02

Similar Documents

Publication Publication Date Title
US4472730A (en) Semiconductor device having an improved moisture resistance
KR940008373B1 (ko) 반도체 장치의 제조방법
US4791465A (en) Field effect transistor type semiconductor sensor and method of manufacturing the same
JPS6085548A (ja) 集積回路装置
JPS6140137B2 (https=)
JPS60224231A (ja) 半導体装置
JPH0680695B2 (ja) 半導体装置
JPS61102758A (ja) 樹脂封止型半導体装置
JPS63216352A (ja) 半導体装置の製造方法
JPS61148824A (ja) 半導体装置の製造方法
JPS62245655A (ja) 半導体装置
JPH04318944A (ja) 樹脂封止型半導体装置
JPS62219541A (ja) 半導体装置
JP2751274B2 (ja) 半導体装置
JPS5974651A (ja) 半導体装置
JPS58166748A (ja) 半導体装置
JPS60140739A (ja) パツシベ−シヨン構造を備えたプラスチツクｉｃパツケ−ジ
JPH06349814A (ja) 半導体集積回路装置
JPS5949687B2 (ja) 半導体装置
JPH08167634A (ja) 半導体装置
JPS59119862A (ja) 半導体装置
JPS62217624A (ja) 半導体装置のボンデイング構造およびその製造方法
JPH035657B2 (https=)
JPS643340B2 (https=)
JPH0277131A (ja) 樹脂封止型半導体装置