JPS6072931A - 紙基材フェノ−ル樹脂積層板の製造法 - Google Patents

紙基材フェノ−ル樹脂積層板の製造法

Info

Publication number
JPS6072931A
JPS6072931A JP18157783A JP18157783A JPS6072931A JP S6072931 A JPS6072931 A JP S6072931A JP 18157783 A JP18157783 A JP 18157783A JP 18157783 A JP18157783 A JP 18157783A JP S6072931 A JPS6072931 A JP S6072931A
Authority
JP
Japan
Prior art keywords
phenolic resin
paper
silane coupling
coupling agent
inorganic filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18157783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH047374B2 (enrdf_load_stackoverflow
Inventor
Mitsuo Yokota
横田　光雄
Naoki Teramoto
直樹 寺本
Yoshihiro Nakamura
吉宏 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP18157783A priority Critical patent/JPS6072931A/ja
Publication of JPS6072931A publication Critical patent/JPS6072931A/ja
Publication of JPH047374B2 publication Critical patent/JPH047374B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP18157783A 1983-09-29 1983-09-29 紙基材フェノ−ル樹脂積層板の製造法 Granted JPS6072931A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18157783A JPS6072931A (ja) 1983-09-29 1983-09-29 紙基材フェノ−ル樹脂積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18157783A JPS6072931A (ja) 1983-09-29 1983-09-29 紙基材フェノ−ル樹脂積層板の製造法

Publications (2)

Publication Number Publication Date
JPS6072931A true JPS6072931A (ja) 1985-04-25
JPH047374B2 JPH047374B2 (enrdf_load_stackoverflow) 1992-02-10

Family

ID=16103234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18157783A Granted JPS6072931A (ja) 1983-09-29 1983-09-29 紙基材フェノ−ル樹脂積層板の製造法

Country Status (1)

Country Link
JP (1) JPS6072931A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6319247A (ja) * 1986-07-11 1988-01-27 東芝ケミカル株式会社 銅張積層板
JPH01146928A (ja) * 1987-12-02 1989-06-08 Toshiba Chem Corp フェノール樹脂銅張積層板
JPH01244850A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法
CN115418881A (zh) * 2022-09-16 2022-12-02 江苏亚振电力有限公司 一种高压互感器用高性能屏蔽绝缘纸制备工艺

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6319247A (ja) * 1986-07-11 1988-01-27 東芝ケミカル株式会社 銅張積層板
JPH01146928A (ja) * 1987-12-02 1989-06-08 Toshiba Chem Corp フェノール樹脂銅張積層板
JPH01244850A (ja) * 1988-03-28 1989-09-29 Matsushita Electric Works Ltd 電気積層板の製造方法
CN115418881A (zh) * 2022-09-16 2022-12-02 江苏亚振电力有限公司 一种高压互感器用高性能屏蔽绝缘纸制备工艺

Also Published As

Publication number Publication date
JPH047374B2 (enrdf_load_stackoverflow) 1992-02-10

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