JPS6066496A - 基板両面回路接続方法 - Google Patents
基板両面回路接続方法Info
- Publication number
- JPS6066496A JPS6066496A JP17533983A JP17533983A JPS6066496A JP S6066496 A JPS6066496 A JP S6066496A JP 17533983 A JP17533983 A JP 17533983A JP 17533983 A JP17533983 A JP 17533983A JP S6066496 A JPS6066496 A JP S6066496A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jumper wire
- board
- wire
- jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 title description 2
- 238000009751 slip forming Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000011889 copper foil Substances 0.000 description 11
- 238000007747 plating Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 235000010650 Hyssopus officinalis Nutrition 0.000 description 1
- 240000001812 Hyssopus officinalis Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17533983A JPS6066496A (ja) | 1983-09-22 | 1983-09-22 | 基板両面回路接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17533983A JPS6066496A (ja) | 1983-09-22 | 1983-09-22 | 基板両面回路接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6066496A true JPS6066496A (ja) | 1985-04-16 |
| JPH0113240B2 JPH0113240B2 (en, 2012) | 1989-03-03 |
Family
ID=15994330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17533983A Granted JPS6066496A (ja) | 1983-09-22 | 1983-09-22 | 基板両面回路接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066496A (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101364U (en, 2012) * | 1990-02-01 | 1991-10-22 | ||
| JPH0718360U (ja) * | 1993-09-06 | 1995-03-31 | 株式会社精工舎 | はんだ付きジャンパー線 |
-
1983
- 1983-09-22 JP JP17533983A patent/JPS6066496A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101364U (en, 2012) * | 1990-02-01 | 1991-10-22 | ||
| JPH0718360U (ja) * | 1993-09-06 | 1995-03-31 | 株式会社精工舎 | はんだ付きジャンパー線 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0113240B2 (en, 2012) | 1989-03-03 |
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