JPS606252U - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS606252U
JPS606252U JP1983099009U JP9900983U JPS606252U JP S606252 U JPS606252 U JP S606252U JP 1983099009 U JP1983099009 U JP 1983099009U JP 9900983 U JP9900983 U JP 9900983U JP S606252 U JPS606252 U JP S606252U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
junction area
abstract
view
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983099009U
Other languages
English (en)
Inventor
丸田　三郎
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1983099009U priority Critical patent/JPS606252U/ja
Publication of JPS606252U publication Critical patent/JPS606252U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Semiconductor Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の１チツプ１パターンの半導体ダイオード
の平面図とそのＡ−Ａ断面図、第２図ａ。 ｂは本考案の一実施例の平面図とそのＡ−Ａ断面図、第
３図ａ、　　ｂは本考案の他の実施例の平面図とそのＡ
−Ａ断面図である。 １・・・・・・ダイオードチップ、Ｄｌ、Ｄ２・・・・
・・。 Ｄ９・・・・・・分割小ダイオードチップ、ｄｌ、　ｄ
２．・・・。 ｄｎ・・・・・・分割小ダイオ、ドパターン、２・・・
・・・ＰＮ接合部、３・・・・・・一方の電極、４・・
・・・・他方の電極、５・・・・・・ケースの金属ベー
ス、６・・・・・・絶縁円筒１、　７・・・・・・ケー
ス上部電極、８・・・・・・接続金属線、９・・・・・
・絶縁膜、１１・・・・・・共通基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数個の分割小ダイオードを一個の容器内で並列に構成
    して所望する接合部面積を有する一個のダイオードと等
    価な接合部面積をもたしめたことを特徴とする半導体装
    置。
JP1983099009U 1983-06-27 1983-06-27 半導体装置 Pending JPS606252U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983099009U JPS606252U (ja) 1983-06-27 1983-06-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983099009U JPS606252U (ja) 1983-06-27 1983-06-27 半導体装置

Publications (1)

Publication Number Publication Date
JPS606252U true JPS606252U (ja) 1985-01-17

Family

ID=30234818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983099009U Pending JPS606252U (ja) 1983-06-27 1983-06-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS606252U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128440U (ja) * 1986-02-07 1987-08-14
JPH0226525U (ja) * 1988-08-10 1990-02-21
JPH02191408A (ja) * 1988-10-26 1990-07-27 Tatsuro Doi 歯ブラシ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62128440U (ja) * 1986-02-07 1987-08-14
JPH0226525U (ja) * 1988-08-10 1990-02-21
JPH02191408A (ja) * 1988-10-26 1990-07-27 Tatsuro Doi 歯ブラシ

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