JPS6060716A - 半導体基板の製造方法 - Google Patents

半導体基板の製造方法

Info

Publication number
JPS6060716A
JPS6060716A JP58169763A JP16976383A JPS6060716A JP S6060716 A JPS6060716 A JP S6060716A JP 58169763 A JP58169763 A JP 58169763A JP 16976383 A JP16976383 A JP 16976383A JP S6060716 A JPS6060716 A JP S6060716A
Authority
JP
Japan
Prior art keywords
substrate
film
ratio
hoi
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58169763A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470771B2 (enExample
Inventor
Akihiko Ishitani
石谷　明彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58169763A priority Critical patent/JPS6060716A/ja
Publication of JPS6060716A publication Critical patent/JPS6060716A/ja
Publication of JPH0470771B2 publication Critical patent/JPH0470771B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10P14/2905—
    • H10P14/24—
    • H10P14/3411—

Landscapes

  • Element Separation (AREA)
JP58169763A 1983-09-14 1983-09-14 半導体基板の製造方法 Granted JPS6060716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58169763A JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58169763A JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6060716A true JPS6060716A (ja) 1985-04-08
JPH0470771B2 JPH0470771B2 (enExample) 1992-11-11

Family

ID=15892397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58169763A Granted JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6060716A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358921A (ja) * 1986-08-29 1988-03-14 Fujitsu Ltd 半導体装置の製造方法
JPH02142117A (ja) * 1988-11-22 1990-05-31 Mitsubishi Electric Corp 半導体集積回路の製造方法
JP2013258257A (ja) * 2012-06-12 2013-12-26 Takehide Shirato 半導体装置の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358921A (ja) * 1986-08-29 1988-03-14 Fujitsu Ltd 半導体装置の製造方法
JPH02142117A (ja) * 1988-11-22 1990-05-31 Mitsubishi Electric Corp 半導体集積回路の製造方法
JP2013258257A (ja) * 2012-06-12 2013-12-26 Takehide Shirato 半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0470771B2 (enExample) 1992-11-11

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