JPH0470771B2 - - Google Patents

Info

Publication number
JPH0470771B2
JPH0470771B2 JP58169763A JP16976383A JPH0470771B2 JP H0470771 B2 JPH0470771 B2 JP H0470771B2 JP 58169763 A JP58169763 A JP 58169763A JP 16976383 A JP16976383 A JP 16976383A JP H0470771 B2 JPH0470771 B2 JP H0470771B2
Authority
JP
Japan
Prior art keywords
substrate
opening
film
hcl
facet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58169763A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6060716A (ja
Inventor
Akihiko Ishitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58169763A priority Critical patent/JPS6060716A/ja
Publication of JPS6060716A publication Critical patent/JPS6060716A/ja
Publication of JPH0470771B2 publication Critical patent/JPH0470771B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium

Landscapes

  • Element Separation (AREA)
JP58169763A 1983-09-14 1983-09-14 半導体基板の製造方法 Granted JPS6060716A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58169763A JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58169763A JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6060716A JPS6060716A (ja) 1985-04-08
JPH0470771B2 true JPH0470771B2 (enExample) 1992-11-11

Family

ID=15892397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58169763A Granted JPS6060716A (ja) 1983-09-14 1983-09-14 半導体基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6060716A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6358921A (ja) * 1986-08-29 1988-03-14 Fujitsu Ltd 半導体装置の製造方法
JPH02142117A (ja) * 1988-11-22 1990-05-31 Mitsubishi Electric Corp 半導体集積回路の製造方法
JP6022816B2 (ja) * 2012-06-12 2016-11-09 猛英 白土 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS6060716A (ja) 1985-04-08

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