JPS6057139U - 集積回路チツプ冷却装置 - Google Patents

集積回路チツプ冷却装置

Info

Publication number
JPS6057139U
JPS6057139U JP1984009219U JP921984U JPS6057139U JP S6057139 U JPS6057139 U JP S6057139U JP 1984009219 U JP1984009219 U JP 1984009219U JP 921984 U JP921984 U JP 921984U JP S6057139 U JPS6057139 U JP S6057139U
Authority
JP
Japan
Prior art keywords
integrated circuit
film
circuit chip
cooling equipment
chip cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984009219U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0135484Y2 (enExample
Inventor
フアクイアー・シー・ミツタル
チヤールス・アール・ソリス
Original Assignee
スペリー・コーポレーシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スペリー・コーポレーシヨン filed Critical スペリー・コーポレーシヨン
Publication of JPS6057139U publication Critical patent/JPS6057139U/ja
Application granted granted Critical
Publication of JPH0135484Y2 publication Critical patent/JPH0135484Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
JP1984009219U 1983-02-07 1984-01-27 集積回路チツプ冷却装置 Granted JPS6057139U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46429483A 1983-02-07 1983-02-07
US464294 1983-02-07

Publications (2)

Publication Number Publication Date
JPS6057139U true JPS6057139U (ja) 1985-04-20
JPH0135484Y2 JPH0135484Y2 (enExample) 1989-10-30

Family

ID=23843332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984009219U Granted JPS6057139U (ja) 1983-02-07 1984-01-27 集積回路チツプ冷却装置

Country Status (3)

Country Link
JP (1) JPS6057139U (enExample)
CA (1) CA1203640A (enExample)
DE (1) DE3404027A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314281A (ja) * 2001-04-16 2002-10-25 Hitachi Ltd 冷却水路を備えた電気装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
EP1506576A1 (de) * 2002-05-22 2005-02-16 Siemens Aktiengesellschaft Kühlvorrichtungen zum kühlen elektrischer bauteile, modul aus kühlvorrichtung und elektrischen bauteilen, und anordnung aus kühlvorrichtung oder modul und trägerkörper

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314281A (ja) * 2001-04-16 2002-10-25 Hitachi Ltd 冷却水路を備えた電気装置

Also Published As

Publication number Publication date
DE3404027A1 (de) 1984-08-16
JPH0135484Y2 (enExample) 1989-10-30
CA1203640A (en) 1986-04-22

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