JPS6050938A - 半導体集積回路 - Google Patents

半導体集積回路

Info

Publication number
JPS6050938A
JPS6050938A JP58160685A JP16068583A JPS6050938A JP S6050938 A JPS6050938 A JP S6050938A JP 58160685 A JP58160685 A JP 58160685A JP 16068583 A JP16068583 A JP 16068583A JP S6050938 A JPS6050938 A JP S6050938A
Authority
JP
Japan
Prior art keywords
terminal
circuit
power supply
supply voltage
functional block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58160685A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6339100B2 (enrdf_load_stackoverflow
Inventor
Keiichi Miyata
宮田　慶一
Takeshi Inoue
剛至 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP58160685A priority Critical patent/JPS6050938A/ja
Publication of JPS6050938A publication Critical patent/JPS6050938A/ja
Publication of JPS6339100B2 publication Critical patent/JPS6339100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP58160685A 1983-08-30 1983-08-30 半導体集積回路 Granted JPS6050938A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58160685A JPS6050938A (ja) 1983-08-30 1983-08-30 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58160685A JPS6050938A (ja) 1983-08-30 1983-08-30 半導体集積回路

Publications (2)

Publication Number Publication Date
JPS6050938A true JPS6050938A (ja) 1985-03-22
JPS6339100B2 JPS6339100B2 (enrdf_load_stackoverflow) 1988-08-03

Family

ID=15720250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58160685A Granted JPS6050938A (ja) 1983-08-30 1983-08-30 半導体集積回路

Country Status (1)

Country Link
JP (1) JPS6050938A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340404U (enrdf_load_stackoverflow) * 1986-09-01 1988-03-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340404U (enrdf_load_stackoverflow) * 1986-09-01 1988-03-16

Also Published As

Publication number Publication date
JPS6339100B2 (enrdf_load_stackoverflow) 1988-08-03

Similar Documents

Publication Publication Date Title
TW560038B (en) Electrostatic discharge protection circuit using whole chip trigger technique
WO2006093729A1 (en) Method and resistive bridge circuit for the detection of solder-joint failures in a digital electronic package
JPH0832434A (ja) 出力回路
US7742265B2 (en) High voltage power supply clamp circuitry for electrostatic discharge (ESD) protection
JP2005184623A (ja) 半導体集積回路装置
CN114465616A (zh) 具有esd保护的电平移位器
JPS6050938A (ja) 半導体集積回路
CN104242280A (zh) 静电防护电路
JP2004247523A (ja) 半導体装置
JP2010266254A (ja) 半導体装置のオープンテスト回路、オープンテスト回路を備えた半導体チップ及び半導体装置
EP0505511A1 (en) ZERO POWER DISSIPATION LASER FUSE IDENTIFICATION CIRCUIT FOR DETECTING REDUNDANCY OF A VERY LARGE INTEGRATION DESIGN.
JP2006129073A (ja) ヒステリシスコンパレータ及びそれを用いたリセット信号発生回路
KR100210553B1 (ko) 반도체 집적 회로
CN112350290B (zh) 操作电路
JP2004525552A (ja) ３端子非反転トランジスタスイッチ
KR100487195B1 (ko) 프로세서의 누설 전류 감소 회로
US20050012531A1 (en) Power-on reset circuit
JPH0563943B2 (enrdf_load_stackoverflow)
TWI804449B (zh) 具有電源毛刺檢測功能之芯片
JPS61154157A (ja) 半導体集積回路
JPH01111365A (ja) 半導体集積回路
TWI701443B (zh) 可偵測不同電壓之電壓偵測電路架構
CN103531244B (zh) 熔丝电路
KR100575888B1 (ko) 패드의 용도 변경이 가능한 반도체 장치
US11063588B1 (en) Reset device, circuit device, and resetting method

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees