JPS6044075A - 塗布剤の自動塗布装置 - Google Patents

塗布剤の自動塗布装置

Info

Publication number
JPS6044075A
JPS6044075A JP15285083A JP15285083A JPS6044075A JP S6044075 A JPS6044075 A JP S6044075A JP 15285083 A JP15285083 A JP 15285083A JP 15285083 A JP15285083 A JP 15285083A JP S6044075 A JPS6044075 A JP S6044075A
Authority
JP
Japan
Prior art keywords
wafer
adhesive
coating
coating agent
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15285083A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6223621B2 (enrdf_load_stackoverflow
Inventor
Mitsuaki Osawa
大沢 光明
Hiroyuki Saito
博之 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M SETETSUKU KK
M Setek Co Ltd
Original Assignee
M SETETSUKU KK
M Setek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M SETETSUKU KK, M Setek Co Ltd filed Critical M SETETSUKU KK
Priority to JP15285083A priority Critical patent/JPS6044075A/ja
Publication of JPS6044075A publication Critical patent/JPS6044075A/ja
Publication of JPS6223621B2 publication Critical patent/JPS6223621B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
JP15285083A 1983-08-22 1983-08-22 塗布剤の自動塗布装置 Granted JPS6044075A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15285083A JPS6044075A (ja) 1983-08-22 1983-08-22 塗布剤の自動塗布装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15285083A JPS6044075A (ja) 1983-08-22 1983-08-22 塗布剤の自動塗布装置

Publications (2)

Publication Number Publication Date
JPS6044075A true JPS6044075A (ja) 1985-03-08
JPS6223621B2 JPS6223621B2 (enrdf_load_stackoverflow) 1987-05-25

Family

ID=15549492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15285083A Granted JPS6044075A (ja) 1983-08-22 1983-08-22 塗布剤の自動塗布装置

Country Status (1)

Country Link
JP (1) JPS6044075A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104623A (ja) * 1984-10-29 1986-05-22 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 回転塗布方法及び回転塗布装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61104623A (ja) * 1984-10-29 1986-05-22 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 回転塗布方法及び回転塗布装置

Also Published As

Publication number Publication date
JPS6223621B2 (enrdf_load_stackoverflow) 1987-05-25

Similar Documents

Publication Publication Date Title
JP2972970B2 (ja) 処理装置
JPH07130695A (ja) 回転式基板処理装置の基板回転保持具
JPH0248136B2 (enrdf_load_stackoverflow)
JP7187112B2 (ja) キャリア板の除去方法
JPH1092781A (ja) 基板の搬送方法及び装置
JPS63256326A (ja) 真空チヤツクおよびその製造方法
US4346124A (en) Method of applying an adhesive to a circuit chip
JP2976085B2 (ja) 処理装置
US20040154530A1 (en) Configuration and a method for reducing contamination with particles on a substrate in a process tool
JPS6044075A (ja) 塗布剤の自動塗布装置
JP2000173906A (ja) 現像液供給方法及び現像装置
JP3504444B2 (ja) レジスト材料の塗布方法及び半導体装置の製造方法
JPS63256342A (ja) 半導体ウエ−ハの研削方法
JP2000158334A (ja) 作業用トレー及び研削方法
JP2000157904A (ja) 塗布装置のニードル硬化防止機構
JPH08290095A (ja) 回転式基板塗布装置
TWI880077B (zh) 樹脂被覆方法及樹脂被覆裝置
JPH0628224Y2 (ja) 基板回転処理装置
JPH0992646A (ja) パッシベーション材の塗布方法およびその装置
JPS5776835A (en) Apparatus for applying liquid on semiconductor substrate
JP2950849B2 (ja) 塗布方法
JPH06318543A (ja) 処理装置
JPH07307282A (ja) 基板塗布装置
JPS60119726A (ja) ウエファの加工装置
JPS61120658A (ja) 塗布装置