JPS6044075A - Automatic coating apparatus of coating agent - Google Patents

Abstract

PURPOSE:To obtain an apparatus capable of automatically and uniformly coating a coating agent without wastefulness, in coating the surface of a semiconductive wafer with wax (adhesive), by downwardly directing a surface to be coated to bring the same into contact with the coating agent before rotating the same. CONSTITUTION:A wafer is carried on the sucking support surface 12 of the vacuum chuck 13 provided to a chuck main body 15 at a position shown by the two dots chain line and a support 18 is revolved by 180 deg. around a shaft 17 in such a state that the wafer is sucked to said support surface 12 to bring the chuck main body 15 to a position shown by the solid line. Herein, the wafer is immersed in an adhesive 6 and a container 7 filled with the adhesive 6 is raised by a cylinder apparatus 9 through a guide body 10, a movable part 11 and a support part 8. Whereupon, the opening end part of the container 7, that is, the adhesive 6 filling the interior thereof under pressure is contacted with the under surface of the wafer W at the upper limit position thereof to be adhered thereto. At this time, when the container 7 is fallen and an electromotor 16 is operated to rotate the chuck 13, the adhesive 6 receives centrifugal force to be spread on the under surface of the wafer W and a uniform thickness layer is formed and, in this state, the chuck main body 15 is returned to the two dots chain line position.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic coating device 6 used when coating wax (adhesive) on the surface of a semiconductor wafer.

When manufacturing integrated circuits, etc., photo printing is carried out to form the pattern of the electronic circuit on the printing sheet.1. ．． Techniques such as wafer deposition, vacuum deposition, and screen printing are widely used, but in order to obtain high-quality integrated circuits, the underlying wafer itself must be of high quality.1. Must be.

Therefore, it has been common practice to bond a plurality of wafers to a substrate made of ceramic or the like and polish the surface of the wafer to make the thickness uniform and to improve the flatness of the surface.

Conventionally, wafers were bonded to substrates manually, by applying wax such as pine resin to one side of one wafer, and then turning it over and pressing E+ to secure it.

However, if it requires a lot of manual labor, not only does it require skill, but it is also difficult to apply the adhesive evenly.
If there is a problem with polishing, the resulting wafer will vary.

The empty chuck that holds the upper wafer and drips the adhesive from the top is rotated at a fairly high speed, so most of the time
+ (approximately 95% l#') of adhesive is not only wasted as it scatters around as it rotates, but it also adheres to the adhesive layer again and deteriorates its quality by holding the coated surface facing downward. By making contact with the coating agent in the container to make it adhere, and then rotating it, there is no wastage of the coating agent, and the coating is easily and uniformly applied. The purpose is to provide an automatic coating device.

An embodiment of the present invention will be described below with reference to one drawing.

In FIGS. 1 to 3, it is a storage tank for a coating agent formed in a part of a base 2, and a heater 3 is provided below it. at the opening of the storage tank.

An annular portion 5 having a tapered portion 4 with a large diameter on the lower side is provided,
Inside thereof, an adhesive 6 such as wax in this embodiment is stored in a molten state as a coating agent.

Further, inside the storage tank 1, there is provided a container 7 having, for example, a curved shape, for scooping up the adhesive 6 and bringing it into contact with the wafer. This container 7 is constructed so that it can be raised and lowered freely. Note that 10 is a movable part that surrounds a guide body 11 for stabilizing the vertical movement of the container 7.

On the F side of each chamber 7 is the vacuum chuck 13, which faces the coils 1 and ζ, with the wafer suction support surface 12 facing downward.

The main body 15 is fixed to the tip I of a support 18 that is rotatable around the shaft 17, and when applying the adhesive 6, it is usually located at the position shown by the solid line, but in other cases, it is fixed at the position I shown by the solid line. As shown by the @ line, the vacuum chuck 13 is at a position rotated by 1800 degrees, with the suction support surface 12 of the vacuum chuck 13 facing upward. In this way, there is a position indicated by the position 15 of the lζ chuck body, *
The empty chuck 13 is carried by the suction and transport mechanism and placed correctly on the suction support surface 12. Here vacuum chuck 13
is activated to adsorb the wafer, and the support body 18 is in a state in which 6 is filled with the axis 17 as the center. Here, the cylinder device 9
When the container 7 is raised by actuating, the liquid adheres to the lower surface of its upper limit.

Here, the sealing device 9 is operated again to lower the container 7 to the position indicated by the two-dot chain line, and the vacuum chuck 13 is rotated by the electric motor 16. As shown in FIG.
spreads under the influence of centrifugal force, forming a layer of uniform thickness.

In this state, the support body 18 is located on the rotation side with respect to the shaft 17, so it is stored in a cassette on the delivery side by a transfer mechanism such as a sliding table mentioned above, and is placed in the primary order. Supplied to the bonding process.

This is because the L coating layer is formed by depositing only a small amount and rotating the vacuum chuck 13.

Since only the necessary amount of the coating agent is applied, there is no chance that it will adhere to unnecessary areas or re-adhere to the layer formed once a day, resulting in a uniform and high-quality coating agent. 1- can be obtained.

This can be done by making the suction surface of the vacuum chuck 13 slightly larger than the semiconductor wafer, or by forming a tapered surface 4 with a larger diameter at the bottom on the annular portion 5.

It is possible to further enhance the effect of preventing the coating agent from going around the back side of the wafer, or regulating the direction of reflection of the coating agent to prevent re-adhesion.

This automatic coating device is used, for example, by being incorporated in the middle of a coating process as shown in FIG. 21.2 in Figure 5
2 are the first and second cassettes on the supply side, 23.24 are the first and second cassettes on the delivery side, 25 is a sliding table on the supply side, 26 is a sliding table on the delivery side, 27
is a guide body that guides these tables 25°26,
28 and 29 are transfer paths on the supply side and the delivery side, respectively. The transfer paths 28 and 29 are composed of, for example, a pair of endless belts made of rubber or the like.

In the figure, the automatic coating device is indicated by the reference numeral 30 as a whole, and
Each component constituting this is indicated by the same reference numerals as in FIGS. 1 to 3.

In the process shown in FIG. 5, two cassettes 21, 22 and 23, 24 are provided on the supply side and the delivery side, respectively, so that a large number of wafers can be processed.

The wafers in the cassette 21 are transferred to the cassette 23 after the coating process, and the wafers in the cassette 22 are transferred to the cassette 2 after the coating process.
4.

In this case, the wafer is supplied by the transfer path 28 on the supply side (+: The wafer is supplied to the automatic coating device fσ30 by the sliding table 25, and the wafer is sent out from the automatic coating device 30 by the sliding tape 26 and the transfer path. 29. The sliding tables 25 and 26 are each movable vertically and horizontally by driving a cylinder device N (not shown).

This invention is not limited to the above-mentioned embodiments, but can be implemented with various modifications without changing the gist.

In the above embodiment, the chuck body 15 can be rotated 1800 times in a vertical plane by the support 18, but it can also be configured to be able to rotate horizontally. In this case, in the embodiment described above, the distance between the container 7 and the vacuum chuck 13 is adjusted by raising and lowering the container 7, but it is also possible to adopt a configuration in which the ivy body 15 is raised and lowered.

Although the above embodiment describes the application of adhesives, the application of coating agents is not limited to adhesives, and the present invention is applicable to the application of adhesives such as photoresists. can also be applied.

As described above, according to the present invention, the surface of the wafer to be coated is held downward, brought into contact with the coating agent in the container, and rotated after the wafer is attached, thereby reducing the waste of coating agent. It is possible to provide an automatic coating device that can easily and automatically apply a coating agent uniformly without any problems.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is an explanatory diagram of an example of a process in which the embodiment is incorporated and used. DESCRIPTION OF SYMBOLS 1... Storage tank 2... Base 3... Heater 4... Taper 5... Annular part 6... Adhesive 7... Container 8... Support part 9... Cylinder Device 10... Guide body 11...
Movable part 12...Adsorption support surface 13...Vacuum chuck 14...Shaft 15...Chuck body 16...Electric motor 17...Shaft 18...Support body 21.22...Supply side Cassettes 23, 24...Cassettes 25, 26 on the sending side...Sliding table 27...Guide body 2
8, 29...Transfer path 30...Automatic coating device agent Patent attorney Yuki Komiya -εp',, -nee,,h-Figure 3Figure 4Figure 1, ・If' display patent application No. 58-152850 2 Name of the invention Automatic coating device for lubricants 3 Relationship with neutrality Patent applicant M Setek Co., Ltd. 5 Voluntary amendment 7 Contents of amendment (1) Specification No. Correct the word "filled" in lines 9 and 10 of page 6 to "filled J." (2) Insert the following sentence next to line 2 of page 10. The above embodiment shows a case where a layer of a coating agent such as an adhesive 6 is formed on the entire surface of the semiconductor wafer W, but in this invention, as shown in FIG. 6(a), the structure of the container 7 is modified. For example, a ring-shaped layer of adhesive 6 can be formed by the bumps as shown in FIG. fc)!It may be provided with a ring-shaped stepped portion 31 as shown in W6.
In C), parts corresponding to those in FIGS. 1 to 4 are designated by the same reference numeral I for convenience of understanding. (3) On page 10, lines 19 and 20, the part that says "This is an explanatory drawing." is corrected as follows. FIG. 3 is an explanatory diagram of a process in which an adhesive is formed on a wafer. (4) Insert the following statement next to page 11, line 13. Note 31...Ring-shaped stepped portions W, W...Semiconductor wafer (5) Figures 6(a) to (C) are added to the drawings attached to this application as attached. Inkoju 6 (a) (b (C)

Claims (4)

[Claims] (1) Above the storage tank containing the coating agent1. An automatic coating device comprising: an empty chuck having a shape corresponding to the surface of a workpiece and for discharging the coating agent in the reservoir; a support for the chuck; (2) The automatic coating agent applicator according to claim 1, further comprising a heater for melting the coating agent in the bottom portion of the tenth storage tank. (3) The coating agent according to claim 1 or 2, wherein the upper vacuum chuck is rotated by 180° in a vertical plane using one end of the support as a fulcrum. Automatic coating equipment. (4) The automatic coating device according to any one of claims 1 to 3, wherein an adhesive is used as the coating agent.