JPS6030690B2 - エポキシ組成物 - Google Patents

エポキシ組成物

Info

Publication number
JPS6030690B2
JPS6030690B2 JP55086725A JP8672580A JPS6030690B2 JP S6030690 B2 JPS6030690 B2 JP S6030690B2 JP 55086725 A JP55086725 A JP 55086725A JP 8672580 A JP8672580 A JP 8672580A JP S6030690 B2 JPS6030690 B2 JP S6030690B2
Authority
JP
Japan
Prior art keywords
composition
copper
parts
weight
epoxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55086725A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5626927A (en
Inventor
チヤ−ルス・ドナルド・ダツドジオン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JPS5626927A publication Critical patent/JPS5626927A/ja
Publication of JPS6030690B2 publication Critical patent/JPS6030690B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/34—Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/20—Patched hole or depression

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Paints Or Removers (AREA)
JP55086725A 1979-06-29 1980-06-27 エポキシ組成物 Expired JPS6030690B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/053,259 US4308118A (en) 1979-06-29 1979-06-29 Deep section curable epoxy resin putty
US53259 1979-06-29

Publications (2)

Publication Number Publication Date
JPS5626927A JPS5626927A (en) 1981-03-16
JPS6030690B2 true JPS6030690B2 (ja) 1985-07-18

Family

ID=21982964

Family Applications (2)

Application Number Title Priority Date Filing Date
JP55086725A Expired JPS6030690B2 (ja) 1979-06-29 1980-06-27 エポキシ組成物
JP60026617A Granted JPS60215017A (ja) 1979-06-29 1985-02-15 基体の充填、架橋又は接合方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP60026617A Granted JPS60215017A (ja) 1979-06-29 1985-02-15 基体の充填、架橋又は接合方法

Country Status (5)

Country Link
US (1) US4308118A (US20080094685A1-20080424-C00004.png)
JP (2) JPS6030690B2 (US20080094685A1-20080424-C00004.png)
DE (1) DE3023696A1 (US20080094685A1-20080424-C00004.png)
FR (1) FR2460307A1 (US20080094685A1-20080424-C00004.png)
GB (1) GB2053226B (US20080094685A1-20080424-C00004.png)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4275190A (en) * 1980-01-08 1981-06-23 General Electric Company Latent heat-curable iodonium/copper salt-catalyzed epoxy resin compositions
US4373040A (en) * 1981-06-05 1983-02-08 General Electric Company Epoxy molding compound
JPS58174418A (ja) * 1982-04-07 1983-10-13 Toshiba Corp 光重合組成物
CA1194637A (en) * 1982-04-26 1985-10-01 Charles R. Morgan Uv and thermally curable, thermoplastic-containing compositions
US4482679A (en) * 1982-09-18 1984-11-13 Ciba-Geigy Corporation Heat-curable epoxy compositions containing diaryliodosyl salts
US4882245A (en) * 1985-10-28 1989-11-21 International Business Machines Corporation Photoresist composition and printed circuit boards and packages made therewith
US4929305A (en) * 1987-01-30 1990-05-29 General Electric Company Method of bonding using UV curable epoxy resin compositions with delayed cure
EP0276716A3 (en) * 1987-01-30 1989-07-26 General Electric Company Uv curable epoxy resin compositions with delayed cure
US4791182A (en) * 1987-09-08 1988-12-13 Dow Chemical Company Copper salts as catalysts for monomers having at least one cyclobutarene group
JPH01118564A (ja) * 1987-10-30 1989-05-11 Toshiba Chem Corp 一液性エポキシ樹脂組成物
US5095053A (en) * 1989-03-27 1992-03-10 General Electric Company Microencapsulation method, microelectronic devices made therefrom, and heat curable compositions
JPH0343940U (US20080094685A1-20080424-C00004.png) * 1989-09-09 1991-04-24
JPH04234422A (ja) * 1990-10-31 1992-08-24 Internatl Business Mach Corp <Ibm> 二重硬化エポキシバックシール処方物
US5384339A (en) * 1993-03-09 1995-01-24 Starkey; Donn R. Epoxy based balancing compound and method for balancing a rotor utilizing an ultraviolet-curable epoxy resin composition
DE4340949A1 (de) * 1993-12-01 1995-06-08 Thera Ges Fuer Patente Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung
DE4421623A1 (de) * 1994-06-21 1996-01-04 Thera Ges Fuer Patente Mehrkomponentige, kationisch härtende Epoxidmassen und deren Verwendung sowie Verfahren zur Herstellung gehärteter Massen
DE69710657T3 (de) * 1996-08-23 2007-07-05 Showa Denko K.K. Photohärtbare Zusammensetzung und Härtungsverfahren
US6277898B1 (en) * 1997-05-21 2001-08-21 Denovus Llc Curable sealant composition
US6858260B2 (en) 1997-05-21 2005-02-22 Denovus Llc Curable sealant composition
US6461691B1 (en) * 1997-05-21 2002-10-08 Denovus Llc Curable sealant composition
US6174932B1 (en) * 1998-05-20 2001-01-16 Denovus Llc Curable sealant composition
JP3950241B2 (ja) * 1997-10-17 2007-07-25 三菱重工業株式会社 樹脂組成物、樹脂硬化物、及び構造物の補修方法、補強方法、補修用材料、補強用材料
EP0983801A3 (en) 1998-09-04 2001-03-14 Dukeplanning &amp; Co. , Inc. Method for repairing the coated surface of a vehicle
US6096383A (en) * 1999-04-28 2000-08-01 Tennant Company Curing of floor coatings using long and short wave ultraviolet radiation
EP1167138A4 (en) * 2000-02-04 2005-02-09 Uegaki Tateo REPAIR APPARATUS FOR VEHICLES
US6610759B1 (en) 2000-03-06 2003-08-26 Curators Of The University Of Missouri Cationically polymerizable adhesive composition containing an acidic component and methods and materials employing same
US6358354B1 (en) 2000-07-05 2002-03-19 Lexmark International, Inc. UV and thermally curable adhesive formulation
US6425655B1 (en) 2001-06-05 2002-07-30 Lexmark International, Inc. Dual curable encapsulating material
US20030124339A1 (en) * 2002-01-03 2003-07-03 Tennant Company Aggregate floor coating and method for applying same
US6761127B2 (en) * 2002-02-28 2004-07-13 Tennant Company Apparatus for curing floor coatings using ultraviolet radiation
JP4276407B2 (ja) * 2002-05-08 2009-06-10 ヘンケル コーポレイション 光カチオン硬化型エポキシ樹脂組成物
DE10232762A1 (de) * 2002-07-18 2004-02-12 Kew Kunststofferzeugnisse Gmbh Wilthen Befestigungsmasse zum Fixieren eines Befestigungselementes und Verfahren
US20060040564A1 (en) * 2004-08-19 2006-02-23 Morrison David S Block-out cover and removal tool
RU2458955C2 (ru) * 2006-07-28 2012-08-20 Лорд Корпорейшн Составы клеев с двойной системой отверждения
US7714037B1 (en) * 2006-12-15 2010-05-11 Henkel Corporation Photoinitiated cationic epoxy compositions and articles exhibiting low color
US8309633B2 (en) * 2008-07-17 2012-11-13 Henkel Ireland Ltd. Low temperature, cationically curable compositions with improved cure speed and toughness
WO2010111082A1 (en) * 2009-03-26 2010-09-30 Tennant Company Ultraviolet curing system including supplemental energy source

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3412046A (en) * 1965-07-01 1968-11-19 Dexter Corp Catalyzed polyepoxide-anhydride resin systems
US3794576A (en) * 1971-05-18 1974-02-26 American Can Co Epoxide blend radiation sensitive catalyst precursor
US3842023A (en) * 1971-10-12 1974-10-15 Chrysler Corp Polymeric solder composition
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4173551A (en) * 1974-05-02 1979-11-06 General Electric Company Heat curable compositions
US4175973A (en) * 1974-05-02 1979-11-27 General Electric Company Curable compositions
US4026705A (en) * 1975-05-02 1977-05-31 General Electric Company Photocurable compositions and methods
US4090936A (en) * 1976-10-28 1978-05-23 Minnesota Mining And Manufacturing Company Photohardenable compositions
GB1587159A (en) * 1977-07-05 1981-04-01 Ciba Geigy Ag Film adhesives containing an epoxide resin
GB2013208B (en) * 1977-12-16 1982-11-24 Gen Electric Heat curable compositions

Also Published As

Publication number Publication date
FR2460307B1 (US20080094685A1-20080424-C00004.png) 1983-10-28
GB2053226B (en) 1983-05-05
JPS5626927A (en) 1981-03-16
FR2460307A1 (fr) 1981-01-23
JPS60215017A (ja) 1985-10-28
GB2053226A (en) 1981-02-04
DE3023696A1 (de) 1981-01-29
JPS6257653B2 (US20080094685A1-20080424-C00004.png) 1987-12-02
US4308118A (en) 1981-12-29

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