JPS6030314A - ダイシング装置 - Google Patents

ダイシング装置

Info

Publication number
JPS6030314A
JPS6030314A JP58124517A JP12451783A JPS6030314A JP S6030314 A JPS6030314 A JP S6030314A JP 58124517 A JP58124517 A JP 58124517A JP 12451783 A JP12451783 A JP 12451783A JP S6030314 A JPS6030314 A JP S6030314A
Authority
JP
Japan
Prior art keywords
dicing
cooling water
flange
blade
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58124517A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0145978B2 (enExample
Inventor
谷崎　昭典
昇 安藤
智 寺山
中尾　邦道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58124517A priority Critical patent/JPS6030314A/ja
Priority to KR1019840003696A priority patent/KR900001993B1/ko
Priority to EP84107440A priority patent/EP0131809B1/en
Priority to DE8484107440T priority patent/DE3473985D1/de
Priority to US06/628,862 priority patent/US4569326A/en
Publication of JPS6030314A publication Critical patent/JPS6030314A/ja
Publication of JPH0145978B2 publication Critical patent/JPH0145978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades
    • B23D61/10—Circular saw blades clamped between hubs; Clamping or aligning devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP58124517A 1983-07-08 1983-07-08 ダイシング装置 Granted JPS6030314A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP58124517A JPS6030314A (ja) 1983-07-08 1983-07-08 ダイシング装置
KR1019840003696A KR900001993B1 (ko) 1983-07-08 1984-06-28 다이싱장치(dicing apparatus)
EP84107440A EP0131809B1 (en) 1983-07-08 1984-06-28 Dicing apparatus
DE8484107440T DE3473985D1 (en) 1983-07-08 1984-06-28 Dicing apparatus
US06/628,862 US4569326A (en) 1983-07-08 1984-07-09 Dicing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58124517A JPS6030314A (ja) 1983-07-08 1983-07-08 ダイシング装置

Publications (2)

Publication Number Publication Date
JPS6030314A true JPS6030314A (ja) 1985-02-15
JPH0145978B2 JPH0145978B2 (enExample) 1989-10-05

Family

ID=14887432

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58124517A Granted JPS6030314A (ja) 1983-07-08 1983-07-08 ダイシング装置

Country Status (5)

Country Link
US (1) US4569326A (enExample)
EP (1) EP0131809B1 (enExample)
JP (1) JPS6030314A (enExample)
KR (1) KR900001993B1 (enExample)
DE (1) DE3473985D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098437A (ja) * 2011-11-02 2013-05-20 Disco Abrasive Syst Ltd 切削装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8901638U1 (de) * 1989-01-31 1989-06-22 Frost, Günther, 8400 Regensburg Vorrichtung zum Zertrennen eines mehrere gedruckte Schaltkreise aufweisenden plattenförmigen Nutzens
DE9015096U1 (de) * 1990-11-02 1991-04-18 Lindner, Horst, 8400 Regensburg Säge zum Trennen von Materialproben
US5252079A (en) * 1992-02-10 1993-10-12 Amp Incorporated Method of manufacture of a contact guide
US5261385A (en) * 1992-03-27 1993-11-16 Dicing Technology Inc. Abrasive cutting blade assembly with multiple cutting edge exposures
US5613350A (en) * 1992-12-24 1997-03-25 Boucher; John N. Method for packaging and handling fragile dicing blade
JP3209818B2 (ja) * 1993-03-08 2001-09-17 株式会社東京精密 ダイシング装置の切削刃取付構造
EP0676253A1 (en) * 1994-04-06 1995-10-11 Motorola, Inc. A chamfered hub blade
US5718615A (en) * 1995-10-20 1998-02-17 Boucher; John N. Semiconductor wafer dicing method
US6152803A (en) * 1995-10-20 2000-11-28 Boucher; John N. Substrate dicing method
JPH08205633A (ja) * 1995-10-27 1996-08-13 Yanmar Agricult Equip Co Ltd 歩行型移植機
KR100225909B1 (ko) * 1997-05-29 1999-10-15 윤종용 웨이퍼 소잉 장치
JP3497071B2 (ja) * 1997-11-20 2004-02-16 東芝機械株式会社 輪郭加工方法および加工機械
JP3482331B2 (ja) * 1997-12-17 2003-12-22 東芝機械株式会社 仕上げ加工方法
US20040112360A1 (en) * 1998-02-12 2004-06-17 Boucher John N. Substrate dicing method
RU2155131C2 (ru) * 1998-09-11 2000-08-27 Ульяновский государственный технический университет Способ резки монокристаллов кремния
JP3485816B2 (ja) * 1998-12-09 2004-01-13 太陽誘電株式会社 ダイシング装置
US20030136394A1 (en) * 2002-01-18 2003-07-24 Texas Instruments Incorporated Dicing saw having an annularly supported dicing blade
JP4753170B2 (ja) * 2004-03-05 2011-08-24 三洋電機株式会社 半導体装置及びその製造方法
JP2013069814A (ja) * 2011-09-21 2013-04-18 Renesas Electronics Corp 半導体装置の製造方法
JP2024050022A (ja) * 2022-09-29 2024-04-10 株式会社ディスコ 切削装置及び切削方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126937A (en) * 1980-03-11 1981-10-05 Toshiba Corp Cutting apparatus for semiconductor wafer
JPS57203553U (enExample) * 1981-06-23 1982-12-24
JPS58111346A (ja) * 1981-12-25 1983-07-02 Hitachi Ltd ダイシング装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2163687A (en) * 1938-01-10 1939-06-27 Bucyrus Monighan Company Cutting
CH223824A (de) * 1940-10-19 1942-10-15 Lindner Herbert Austrittsdüse an Schleifmaschinen zum Zuführen der Schleifflüssigkeit zur Schleifscheibe.
GB865811A (en) * 1958-01-23 1961-04-19 James Thomas Pascoe Improvements in or relating to circular saw assemblies
US3886925A (en) * 1973-06-20 1975-06-03 Barrie F Regan Cutting wheel
FR2382097A1 (fr) * 1977-02-23 1978-09-22 Radiotechnique Compelec Procede de fabrication de diodes semi-conductrices de type p-i-n

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126937A (en) * 1980-03-11 1981-10-05 Toshiba Corp Cutting apparatus for semiconductor wafer
JPS57203553U (enExample) * 1981-06-23 1982-12-24
JPS58111346A (ja) * 1981-12-25 1983-07-02 Hitachi Ltd ダイシング装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013098437A (ja) * 2011-11-02 2013-05-20 Disco Abrasive Syst Ltd 切削装置

Also Published As

Publication number Publication date
KR850001062A (enExample) 1985-03-14
US4569326A (en) 1986-02-11
EP0131809B1 (en) 1988-09-07
DE3473985D1 (en) 1988-10-13
EP0131809A1 (en) 1985-01-23
JPH0145978B2 (enExample) 1989-10-05
KR900001993B1 (ko) 1990-03-31

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