JPS60248725A - エポキシ樹脂粉体組成物 - Google Patents

エポキシ樹脂粉体組成物

Info

Publication number
JPS60248725A
JPS60248725A JP10623384A JP10623384A JPS60248725A JP S60248725 A JPS60248725 A JP S60248725A JP 10623384 A JP10623384 A JP 10623384A JP 10623384 A JP10623384 A JP 10623384A JP S60248725 A JPS60248725 A JP S60248725A
Authority
JP
Japan
Prior art keywords
epoxy resin
curing agent
curing
powder composition
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10623384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216926B2 (enrdf_load_stackoverflow
Inventor
Yuzo Akata
祐三 赤田
Norio Kawamoto
河本　紀雄
Kiyoshi Saito
潔 斉藤
Hitoshi Takahira
等 高比良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP10623384A priority Critical patent/JPS60248725A/ja
Publication of JPS60248725A publication Critical patent/JPS60248725A/ja
Publication of JPH0216926B2 publication Critical patent/JPH0216926B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP10623384A 1984-05-24 1984-05-24 エポキシ樹脂粉体組成物 Granted JPS60248725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10623384A JPS60248725A (ja) 1984-05-24 1984-05-24 エポキシ樹脂粉体組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10623384A JPS60248725A (ja) 1984-05-24 1984-05-24 エポキシ樹脂粉体組成物

Publications (2)

Publication Number Publication Date
JPS60248725A true JPS60248725A (ja) 1985-12-09
JPH0216926B2 JPH0216926B2 (enrdf_load_stackoverflow) 1990-04-18

Family

ID=14428401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10623384A Granted JPS60248725A (ja) 1984-05-24 1984-05-24 エポキシ樹脂粉体組成物

Country Status (1)

Country Link
JP (1) JPS60248725A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240375A (ja) * 1986-04-11 1987-10-21 Nitto Electric Ind Co Ltd 熱硬化性接着シ−ト
JPS62285966A (ja) * 1986-06-04 1987-12-11 Yuka Shell Epoxy Kk エポキシ樹脂粉体塗料組成物
JPH01268711A (ja) * 1988-04-20 1989-10-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0451548A (ja) * 1990-06-19 1992-02-20 Nitto Denko Corp 半導体装置
JPH04175331A (ja) * 1990-11-08 1992-06-23 Yuka Shell Epoxy Kk エポキシ樹脂粉体組成物
EP0705856A3 (enrdf_load_stackoverflow) * 1994-10-07 1996-05-01 Shell Int Research

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5839677A (ja) * 1981-09-02 1983-03-08 Mitsubishi Petrochem Co Ltd 新規ポリエポキシ化合物

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62240375A (ja) * 1986-04-11 1987-10-21 Nitto Electric Ind Co Ltd 熱硬化性接着シ−ト
JPS62285966A (ja) * 1986-06-04 1987-12-11 Yuka Shell Epoxy Kk エポキシ樹脂粉体塗料組成物
JPH01268711A (ja) * 1988-04-20 1989-10-26 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPH0451548A (ja) * 1990-06-19 1992-02-20 Nitto Denko Corp 半導体装置
JPH04175331A (ja) * 1990-11-08 1992-06-23 Yuka Shell Epoxy Kk エポキシ樹脂粉体組成物
EP0705856A3 (enrdf_load_stackoverflow) * 1994-10-07 1996-05-01 Shell Int Research
US5739186A (en) * 1994-10-07 1998-04-14 Shell Oil Company Epoxy resin composition for semiconductor encapsulation

Also Published As

Publication number Publication date
JPH0216926B2 (enrdf_load_stackoverflow) 1990-04-18

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term