JPS60245221A - 電子ビ−ム描画装置用ウエハホルダ - Google Patents
電子ビ−ム描画装置用ウエハホルダInfo
- Publication number
- JPS60245221A JPS60245221A JP59102277A JP10227784A JPS60245221A JP S60245221 A JPS60245221 A JP S60245221A JP 59102277 A JP59102277 A JP 59102277A JP 10227784 A JP10227784 A JP 10227784A JP S60245221 A JPS60245221 A JP S60245221A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer holder
- electron beam
- positioning
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010894 electron beam technology Methods 0.000 title abstract description 5
- 238000000609 electron-beam lithography Methods 0.000 claims description 7
- 239000000696 magnetic material Substances 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 1
- 230000001018 virulence Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Electron Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59102277A JPS60245221A (ja) | 1984-05-21 | 1984-05-21 | 電子ビ−ム描画装置用ウエハホルダ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59102277A JPS60245221A (ja) | 1984-05-21 | 1984-05-21 | 電子ビ−ム描画装置用ウエハホルダ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60245221A true JPS60245221A (ja) | 1985-12-05 |
| JPH0414491B2 JPH0414491B2 (enrdf_load_stackoverflow) | 1992-03-13 |
Family
ID=14323103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59102277A Granted JPS60245221A (ja) | 1984-05-21 | 1984-05-21 | 電子ビ−ム描画装置用ウエハホルダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60245221A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5095300A (en) * | 1990-03-28 | 1992-03-10 | Nec Electronics Inc. | Device for sensing side positioning of wafers |
-
1984
- 1984-05-21 JP JP59102277A patent/JPS60245221A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5095300A (en) * | 1990-03-28 | 1992-03-10 | Nec Electronics Inc. | Device for sensing side positioning of wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414491B2 (enrdf_load_stackoverflow) | 1992-03-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |