JPS60223139A - 半導体ウエハ固定用接着薄板 - Google Patents

半導体ウエハ固定用接着薄板

Info

Publication number
JPS60223139A
JPS60223139A JP59078937A JP7893784A JPS60223139A JP S60223139 A JPS60223139 A JP S60223139A JP 59078937 A JP59078937 A JP 59078937A JP 7893784 A JP7893784 A JP 7893784A JP S60223139 A JPS60223139 A JP S60223139A
Authority
JP
Japan
Prior art keywords
pressure
adhesive layer
electron beam
semiconductor wafer
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59078937A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570937B2 (enrdf_load_stackoverflow
Inventor
Takemasa Uemura
植村　剛正
Yoshinari Satoda
良成 里田
Eiji Shigemura
重村　栄二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP59078937A priority Critical patent/JPS60223139A/ja
Publication of JPS60223139A publication Critical patent/JPS60223139A/ja
Publication of JPH0570937B2 publication Critical patent/JPH0570937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP59078937A 1984-04-18 1984-04-18 半導体ウエハ固定用接着薄板 Granted JPS60223139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59078937A JPS60223139A (ja) 1984-04-18 1984-04-18 半導体ウエハ固定用接着薄板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59078937A JPS60223139A (ja) 1984-04-18 1984-04-18 半導体ウエハ固定用接着薄板

Publications (2)

Publication Number Publication Date
JPS60223139A true JPS60223139A (ja) 1985-11-07
JPH0570937B2 JPH0570937B2 (enrdf_load_stackoverflow) 1993-10-06

Family

ID=13675790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59078937A Granted JPS60223139A (ja) 1984-04-18 1984-04-18 半導体ウエハ固定用接着薄板

Country Status (1)

Country Link
JP (1) JPS60223139A (enrdf_load_stackoverflow)

Cited By (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0775715A2 (en) 1995-11-22 1997-05-28 LINTEC Corporation Adhesive composition and adhesive sheet
US5942578A (en) * 1996-04-19 1999-08-24 Lintec Corp. Energy beam curable pressure sensitive adhesive composition and use thereof
US6040048A (en) * 1997-08-28 2000-03-21 Lintec Corporation Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
US6277481B1 (en) 1998-07-06 2001-08-21 Lintec Corporation Adhesive composition and adhesive sheet
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
US6398892B1 (en) 1998-08-26 2002-06-04 Lintec Corporation Method of using pressure sensitive adhesive double coated sheet
US6403215B1 (en) 1998-05-22 2002-06-11 Lintec Corporation Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
US6436795B2 (en) 2000-02-07 2002-08-20 Lintec Corporation Process for producing semiconductor chip
US6465330B1 (en) 1998-08-18 2002-10-15 Lintec Corporation Method for grinding a wafer back
US6524700B2 (en) 2000-02-18 2003-02-25 Nec Corporation Pressure sensitive adhesive sheet for wafer sticking
US6524701B1 (en) 1998-11-20 2003-02-25 Lintec Corporation Pressure sensitive adhesive sheet and method of use thereof
US6558975B2 (en) 2000-08-31 2003-05-06 Lintec Corporation Process for producing semiconductor device
US6605345B2 (en) 2000-07-07 2003-08-12 Lintec Corporation Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
US6718223B1 (en) 1999-05-18 2004-04-06 Lintec Corporation Method of processing semiconductor wafer and semiconductor wafer supporting member
US6919262B2 (en) 2001-03-21 2005-07-19 Lintec Corporation Process for producing semiconductor chips
US7041190B2 (en) 2002-06-10 2006-05-09 Nitto Denko Corporation Adhesive sheet for dicing glass substrate and method of dicing glass substrate
US7105226B2 (en) 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
US7135224B2 (en) 2001-08-21 2006-11-14 Lintec Corporation Adhesive tape
WO2007116856A1 (ja) 2006-04-03 2007-10-18 Gunze Limited 半導体ウェハの裏面研削に用いる表面保護テープ及び該表面保護テープ用基材フィルム
EP1892276A1 (en) 2006-08-22 2008-02-27 Nitto Denko Corporation Pressure-sensitive adhesive sheet
US7351645B2 (en) 2004-06-02 2008-04-01 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
EP1970422A2 (en) 2007-03-13 2008-09-17 Toray Saehan Inc. Adhesive film for stacking semiconductor chips
US7479317B2 (en) 2004-02-26 2009-01-20 Nitto Denko Corporation Adhesive sheet roll for wafer processing
EP2270848A2 (en) 2002-08-28 2011-01-05 Lintec Corporation Multilayer protective sheet for a semiconductor wafer and structure comprising said wafer and sheet, method for protecting semiconductor wafer and method for processing semiconductor wafer
US8057894B2 (en) 2004-10-22 2011-11-15 Toray Advanced Materials Korea, Inc. Adhesive tape for electronic components
US8114520B2 (en) 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
US8174130B2 (en) 2006-12-05 2012-05-08 Lintec Corporation Laser dicing sheet and manufacturing method for chip body
EP2518114A1 (en) 2011-04-25 2012-10-31 Toray Advanced Materials Korea Inc. Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same
US8392011B2 (en) 2005-06-29 2013-03-05 Lintec Corporation Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
US8524833B2 (en) 2009-05-20 2013-09-03 Toray Advanced Materials Korea Inc. High-efficiency light diffusing polymeric film and manufacturing method thereof
JP2013221073A (ja) * 2012-04-16 2013-10-28 Nitto Denko Corp 粘着シート及び粘着剤組成物
KR20140123951A (ko) 2012-01-12 2014-10-23 덴끼 가가꾸 고교 가부시키가이샤 점착 시트 및 전자 부품의 제조 방법
US9559073B2 (en) 2011-03-22 2017-01-31 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
US9670382B2 (en) 2011-03-22 2017-06-06 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
KR20190017158A (ko) 2017-08-10 2019-02-20 애경화학 주식회사 Uv경화 후 내수성 웨이퍼 비점착 특성을 가지는 반도체 웨이퍼 공정용 고분자량 아크릴 점착제 조성물 및 그 제조방법
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653597A (en) * 1979-10-09 1981-05-13 Mereka Denshi Kogyo:Kk Induction motor speed control device
JPS57137371A (en) * 1981-02-19 1982-08-24 Toyo Ink Mfg Co Ltd Hot-melt pressure -sensitive adhesive
JPS5830809A (ja) * 1981-08-17 1983-02-23 Fuji Heavy Ind Ltd 自動車の車高制御方法
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備
JPS5918775A (ja) * 1982-07-22 1984-01-31 Hitachi Chem Co Ltd 放射線硬化型感圧性接着剤組成物
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5653597A (en) * 1979-10-09 1981-05-13 Mereka Denshi Kogyo:Kk Induction motor speed control device
JPS57137371A (en) * 1981-02-19 1982-08-24 Toyo Ink Mfg Co Ltd Hot-melt pressure -sensitive adhesive
JPS5830809A (ja) * 1981-08-17 1983-02-23 Fuji Heavy Ind Ltd 自動車の車高制御方法
JPS5850164A (ja) * 1981-09-19 1983-03-24 Nippon Steel Corp 連続鋳造設備
JPS5918775A (ja) * 1982-07-22 1984-01-31 Hitachi Chem Co Ltd 放射線硬化型感圧性接着剤組成物
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0775715A2 (en) 1995-11-22 1997-05-28 LINTEC Corporation Adhesive composition and adhesive sheet
US5942578A (en) * 1996-04-19 1999-08-24 Lintec Corp. Energy beam curable pressure sensitive adhesive composition and use thereof
US6040048A (en) * 1997-08-28 2000-03-21 Lintec Corporation Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
US6403215B1 (en) 1998-05-22 2002-06-11 Lintec Corporation Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof
US6277481B1 (en) 1998-07-06 2001-08-21 Lintec Corporation Adhesive composition and adhesive sheet
US6465330B1 (en) 1998-08-18 2002-10-15 Lintec Corporation Method for grinding a wafer back
US6398892B1 (en) 1998-08-26 2002-06-04 Lintec Corporation Method of using pressure sensitive adhesive double coated sheet
US7105226B2 (en) 1998-08-26 2006-09-12 Lintec Corporation Pressure sensitive adhesive double coated sheet and method of use thereof
US6524701B1 (en) 1998-11-20 2003-02-25 Lintec Corporation Pressure sensitive adhesive sheet and method of use thereof
US6718223B1 (en) 1999-05-18 2004-04-06 Lintec Corporation Method of processing semiconductor wafer and semiconductor wafer supporting member
US6436795B2 (en) 2000-02-07 2002-08-20 Lintec Corporation Process for producing semiconductor chip
US6524700B2 (en) 2000-02-18 2003-02-25 Nec Corporation Pressure sensitive adhesive sheet for wafer sticking
JP2001240842A (ja) * 2000-02-28 2001-09-04 Nitto Denko Corp 紫外線硬化型粘着剤組成物とその粘着シ―ト類
US6605345B2 (en) 2000-07-07 2003-08-12 Lintec Corporation Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheet
US6558975B2 (en) 2000-08-31 2003-05-06 Lintec Corporation Process for producing semiconductor device
EP2911189A1 (en) 2001-03-21 2015-08-26 Lintec Corporation Sheet to form a protective film for chips and process for producing semiconductor chips
US7235465B2 (en) 2001-03-21 2007-06-26 Lintec Corporation Process for producing semiconductor chips having a protective film on the back surface
US7408259B2 (en) 2001-03-21 2008-08-05 Lintec Corporation Sheet to form a protective film for chips
US6919262B2 (en) 2001-03-21 2005-07-19 Lintec Corporation Process for producing semiconductor chips
US7135224B2 (en) 2001-08-21 2006-11-14 Lintec Corporation Adhesive tape
US7041190B2 (en) 2002-06-10 2006-05-09 Nitto Denko Corporation Adhesive sheet for dicing glass substrate and method of dicing glass substrate
EP2270848A2 (en) 2002-08-28 2011-01-05 Lintec Corporation Multilayer protective sheet for a semiconductor wafer and structure comprising said wafer and sheet, method for protecting semiconductor wafer and method for processing semiconductor wafer
US7479317B2 (en) 2004-02-26 2009-01-20 Nitto Denko Corporation Adhesive sheet roll for wafer processing
US7351645B2 (en) 2004-06-02 2008-04-01 Lintec Corporation Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
US8057894B2 (en) 2004-10-22 2011-11-15 Toray Advanced Materials Korea, Inc. Adhesive tape for electronic components
US8392011B2 (en) 2005-06-29 2013-03-05 Lintec Corporation Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
WO2007116856A1 (ja) 2006-04-03 2007-10-18 Gunze Limited 半導体ウェハの裏面研削に用いる表面保護テープ及び該表面保護テープ用基材フィルム
EP1892276A1 (en) 2006-08-22 2008-02-27 Nitto Denko Corporation Pressure-sensitive adhesive sheet
US8174130B2 (en) 2006-12-05 2012-05-08 Lintec Corporation Laser dicing sheet and manufacturing method for chip body
US8114520B2 (en) 2006-12-05 2012-02-14 Lintec Corporation Laser dicing sheet and process for producing chip body
EP1970422A2 (en) 2007-03-13 2008-09-17 Toray Saehan Inc. Adhesive film for stacking semiconductor chips
US7960023B2 (en) 2007-03-13 2011-06-14 Toray Advanced Materials Korea Inc. Adhesive film for stacking semiconductor chips
US8524833B2 (en) 2009-05-20 2013-09-03 Toray Advanced Materials Korea Inc. High-efficiency light diffusing polymeric film and manufacturing method thereof
US9559073B2 (en) 2011-03-22 2017-01-31 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
US9670382B2 (en) 2011-03-22 2017-06-06 Lintec Corporation Base film and pressure-sensitive adhesive sheet provided therewith
US8945668B2 (en) 2011-04-25 2015-02-03 Toray Advanced Materials Korea Inc. Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same
EP2518114A1 (en) 2011-04-25 2012-10-31 Toray Advanced Materials Korea Inc. Phenoxy resin composition for transparent plastic substrate and transparent plastic substrate using the same
KR20140123951A (ko) 2012-01-12 2014-10-23 덴끼 가가꾸 고교 가부시키가이샤 점착 시트 및 전자 부품의 제조 방법
JP2013221073A (ja) * 2012-04-16 2013-10-28 Nitto Denko Corp 粘着シート及び粘着剤組成物
US10224230B2 (en) 2014-10-23 2019-03-05 Lintec Corporation Surface protective sheet
KR20190017158A (ko) 2017-08-10 2019-02-20 애경화학 주식회사 Uv경화 후 내수성 웨이퍼 비점착 특성을 가지는 반도체 웨이퍼 공정용 고분자량 아크릴 점착제 조성물 및 그 제조방법

Also Published As

Publication number Publication date
JPH0570937B2 (enrdf_load_stackoverflow) 1993-10-06

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