JPS57137371A - Hot-melt pressure -sensitive adhesive - Google Patents
Hot-melt pressure -sensitive adhesiveInfo
- Publication number
- JPS57137371A JPS57137371A JP2228381A JP2228381A JPS57137371A JP S57137371 A JPS57137371 A JP S57137371A JP 2228381 A JP2228381 A JP 2228381A JP 2228381 A JP2228381 A JP 2228381A JP S57137371 A JPS57137371 A JP S57137371A
- Authority
- JP
- Japan
- Prior art keywords
- alkyl acrylate
- hot
- styrene
- radiation
- product obtained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012943 hotmelt Substances 0.000 title abstract 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title 1
- 125000005250 alkyl acrylate group Chemical group 0.000 abstract 3
- 239000000178 monomer Substances 0.000 abstract 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 230000000379 polymerizing effect Effects 0.000 abstract 2
- 230000005855 radiation Effects 0.000 abstract 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- 244000043261 Hevea brasiliensis Species 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- -1 alkyl methacrylate Chemical compound 0.000 abstract 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 abstract 1
- 239000012965 benzophenone Substances 0.000 abstract 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- 150000001993 dienes Chemical class 0.000 abstract 1
- 229920003052 natural elastomer Polymers 0.000 abstract 1
- 229920001194 natural rubber Polymers 0.000 abstract 1
- 229920003048 styrene butadiene rubber Polymers 0.000 abstract 1
- 229920001567 vinyl ester resin Polymers 0.000 abstract 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Graft Or Block Polymers (AREA)
Abstract
PURPOSE: The titled ahdesive, consisting of a product obtained by polymerizing a polymerizable monomer consisting of an alkyl acrylate essentially in the presence of a diene polymer, croslinkable with radiation, and having improved tanckiness and heat resistance.
CONSTITUTION: A product obtained by polymerizing 100pts.wt. polymerizable monomer consisting of (B) an alkyl acrylate essentially, e.g. 0W45wt% 1W10C alkyl acrylate, and if necessary 1W12C alkyl methacrylate, vinyl ester monomer, styrene and acrylonitrile and 0W30wt% unsaturated carboxylic acid, in the presence of (A) 0.3W10pts.wt. dinene polymer, e.g. natural rubber or styrene- butadiene rubber, in a hot-melt state having a viscosity ≤30,000 cp at 180°C is applied to an article, and crosslinked with radiation in the absence or presence of a sensitizer, e.g. benzophenone, to give the aimed adhesive.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2228381A JPS57137371A (en) | 1981-02-19 | 1981-02-19 | Hot-melt pressure -sensitive adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2228381A JPS57137371A (en) | 1981-02-19 | 1981-02-19 | Hot-melt pressure -sensitive adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57137371A true JPS57137371A (en) | 1982-08-24 |
| JPH0253471B2 JPH0253471B2 (en) | 1990-11-16 |
Family
ID=12078418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2228381A Granted JPS57137371A (en) | 1981-02-19 | 1981-02-19 | Hot-melt pressure -sensitive adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57137371A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223139A (en) * | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | Bonding sheet for fixing semiconductor wafer |
-
1981
- 1981-02-19 JP JP2228381A patent/JPS57137371A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60223139A (en) * | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | Bonding sheet for fixing semiconductor wafer |
| JPH0570937B2 (en) * | 1984-04-18 | 1993-10-06 | Nitto Denko Corp |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0253471B2 (en) | 1990-11-16 |
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