JPS60218862A - 半導体リ−ドフレ−ム - Google Patents

半導体リ−ドフレ−ム

Info

Publication number
JPS60218862A
JPS60218862A JP59074328A JP7432884A JPS60218862A JP S60218862 A JPS60218862 A JP S60218862A JP 59074328 A JP59074328 A JP 59074328A JP 7432884 A JP7432884 A JP 7432884A JP S60218862 A JPS60218862 A JP S60218862A
Authority
JP
Japan
Prior art keywords
lead frame
wire
lead
bonding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59074328A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0460346B2 (https=
Inventor
Shoji Shiga
志賀　章二
Toru Tanigawa
徹 谷川
Hiroki Suzuki
鈴木　比呂輝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59074328A priority Critical patent/JPS60218862A/ja
Publication of JPS60218862A publication Critical patent/JPS60218862A/ja
Publication of JPH0460346B2 publication Critical patent/JPH0460346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP59074328A 1984-04-13 1984-04-13 半導体リ−ドフレ−ム Granted JPS60218862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59074328A JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59074328A JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS60218862A true JPS60218862A (ja) 1985-11-01
JPH0460346B2 JPH0460346B2 (https=) 1992-09-25

Family

ID=13543933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59074328A Granted JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS60218862A (https=)

Also Published As

Publication number Publication date
JPH0460346B2 (https=) 1992-09-25

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