JPH0460346B2 - - Google Patents

Info

Publication number
JPH0460346B2
JPH0460346B2 JP59074328A JP7432884A JPH0460346B2 JP H0460346 B2 JPH0460346 B2 JP H0460346B2 JP 59074328 A JP59074328 A JP 59074328A JP 7432884 A JP7432884 A JP 7432884A JP H0460346 B2 JPH0460346 B2 JP H0460346B2
Authority
JP
Japan
Prior art keywords
wire
lead
lead frame
bonding
inner lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59074328A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60218862A (ja
Inventor
Shoji Shiga
Tooru Tanigawa
Hiroki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP59074328A priority Critical patent/JPS60218862A/ja
Publication of JPS60218862A publication Critical patent/JPS60218862A/ja
Publication of JPH0460346B2 publication Critical patent/JPH0460346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP59074328A 1984-04-13 1984-04-13 半導体リ−ドフレ−ム Granted JPS60218862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59074328A JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59074328A JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS60218862A JPS60218862A (ja) 1985-11-01
JPH0460346B2 true JPH0460346B2 (https=) 1992-09-25

Family

ID=13543933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59074328A Granted JPS60218862A (ja) 1984-04-13 1984-04-13 半導体リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS60218862A (https=)

Also Published As

Publication number Publication date
JPS60218862A (ja) 1985-11-01

Similar Documents

Publication Publication Date Title
EP0637082B1 (en) Leadframe for an integrated circuit device
US5550407A (en) Semiconductor device having an aluminum alloy wiring line
KR910003574B1 (ko) 내식성 알루미늄 전자재료
US9972598B2 (en) Method of manufacturing semiconductor device
JP2001284792A (ja) 半田材料及びそれを用いた半導体装置の製造方法
EP0178170B1 (en) Semiconductor device having a bonding wire and method for manufacturing it
JP2000156452A (ja) リ―ドフレ―ムとその製造方法、およびそれを用いた半導体パッケ―ジ
KR910000154B1 (ko) 반도체장치와 그 재법 및 그것에 사용되는 본딩와이어
JPH0460346B2 (https=)
JP2001144111A (ja) 半導体装置の製造方法
JPH1074879A (ja) 半導体装置用リードフレーム
JPH0141028B2 (https=)
JP2771145B2 (ja) 耐腐食性リードフレーム
JP2797846B2 (ja) 樹脂封止型半導体装置のＣｕ合金製リードフレーム材
JPS63169056A (ja) リ−ドフレ−ム材料
JPH08204081A (ja) 半導体装置用リードフレーム及び半導体装置とその製造法
JPS60149154A (ja) 半導体装置の製造方法
JP2721259B2 (ja) ワイヤボンディング方法及びそれに使用する銅系リードフレーム
JPS60218863A (ja) 半導体リ−ドフレ−ム
JPH0558259B2 (https=)
JPH09116064A (ja) リードフレーム材
JP3086126B2 (ja) バンプ用微小金ボール
JP3091076B2 (ja) バンプ用微小金ボール
JPH07202109A (ja) 半導体パッケージ
JPH02251155A (ja) 半導体素子用金合金細線及びその接合方法