JPS60218853A - ウエーハ前整列装置 - Google Patents

ウエーハ前整列装置

Info

Publication number
JPS60218853A
JPS60218853A JP6105685A JP6105685A JPS60218853A JP S60218853 A JPS60218853 A JP S60218853A JP 6105685 A JP6105685 A JP 6105685A JP 6105685 A JP6105685 A JP 6105685A JP S60218853 A JPS60218853 A JP S60218853A
Authority
JP
Japan
Prior art keywords
wafer
shaft
shaft means
alignment
alignment device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6105685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0556653B2 (enrdf_load_stackoverflow
Inventor
ダニエル・エヌ・ギヤルバート
ジエレ・デイー・バツクレイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Biosystems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Publication of JPS60218853A publication Critical patent/JPS60218853A/ja
Publication of JPH0556653B2 publication Critical patent/JPH0556653B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP6105685A 1984-03-30 1985-03-27 ウエーハ前整列装置 Granted JPS60218853A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59518884A 1984-03-30 1984-03-30
US595188 1984-03-30

Publications (2)

Publication Number Publication Date
JPS60218853A true JPS60218853A (ja) 1985-11-01
JPH0556653B2 JPH0556653B2 (enrdf_load_stackoverflow) 1993-08-20

Family

ID=24382131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6105685A Granted JPS60218853A (ja) 1984-03-30 1985-03-27 ウエーハ前整列装置

Country Status (3)

Country Link
JP (1) JPS60218853A (enrdf_load_stackoverflow)
DE (1) DE3506782C2 (enrdf_load_stackoverflow)
GB (1) GB2157078B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6323332A (ja) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド ウエーハ移送方法及び装置
JP2017526158A (ja) * 2014-05-17 2017-09-07 ケーエルエー−テンカー コーポレイション ウェーハエッジ検出および検査

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL86514A0 (enrdf_load_stackoverflow) * 1988-05-26 1988-11-15
DE19510230C2 (de) * 1995-03-24 1999-08-05 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips
GB2337111B (en) * 1996-06-15 2000-03-15 Unova Uk Ltd Workpiece inspection
DE69738673D1 (de) * 1996-06-15 2008-06-19 Cinetic Landis Grinding Ltd Flexible verbindung einer schleifmaschinenspindel zu einer plattform
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
DE19957758C2 (de) * 1999-12-01 2001-10-25 Steag Rtp Systems Gmbh Vorrichtung und Verfahren zum Ausrichten von scheibenförmigen Substraten
WO2001078114A1 (en) 2000-04-07 2001-10-18 Varian Semiconductor Equipment Associates, Inc. WAFER ORIENTATION SENSOR FOR GaAs WAFERS
DE102004025150B4 (de) 2004-05-21 2019-05-09 Mattson Technology, Inc. Lagebestimmung eines Halbleitersubstrats auf einer Rotationsvorrichtung
GB201721722D0 (en) 2017-12-22 2018-02-07 Pilkington Group Ltd Switching device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57198642A (en) * 1981-05-30 1982-12-06 Toshiba Corp Wafer position detection device
JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604940A (en) * 1969-08-04 1971-09-14 Laser Systems Corp Radiant energy inspection system for rotating objects
US3826576A (en) * 1972-12-20 1974-07-30 Goodyear Aerospace Corp Laser measuring or monitoring system
US4425075A (en) * 1981-04-20 1984-01-10 The Perkin-Elmer Corporation Wafer aligners

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57198642A (en) * 1981-05-30 1982-12-06 Toshiba Corp Wafer position detection device
JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6323332A (ja) * 1986-04-28 1988-01-30 バリアン・アソシエイツ・インコ−ポレイテツド ウエーハ移送方法及び装置
JP2017526158A (ja) * 2014-05-17 2017-09-07 ケーエルエー−テンカー コーポレイション ウェーハエッジ検出および検査

Also Published As

Publication number Publication date
DE3506782A1 (de) 1985-10-10
DE3506782C2 (de) 1994-10-27
GB2157078B (en) 1987-09-30
JPH0556653B2 (enrdf_load_stackoverflow) 1993-08-20
GB2157078A (en) 1985-10-16
GB8502075D0 (en) 1985-02-27

Similar Documents

Publication Publication Date Title
US4907035A (en) Universal edged-based wafer alignment apparatus
US6275742B1 (en) Wafer aligner system
US6117193A (en) Optical sensor array mounting and alignment
JPH01127238A (ja) 可動部材用の限定的再位置決め区域における位置フイードバック向上
JPS60218853A (ja) ウエーハ前整列装置
JPH1089904A (ja) Ｖノッチウェハ位置決め装置
KR20030065414A (ko) 기판상에 반도체 다이의 기준촛점을 위치시키고배치시키는 방법
US10094684B2 (en) Method of manufacturing rotary scale, rotary scale, rotary encoder, driving apparatus, image pickup apparatus and robot apparatus
JPH0243511A (ja) イメージセンサ対の光学系との位置合わせ方法
US5600123A (en) High-resolution extended field-of-view tracking apparatus and method
JPS63280435A (ja) ウエハのプリアライメント装置
US6201603B1 (en) Position detecting apparatus for semiconductor wafer
JP2874795B2 (ja) オリエンテーションフラット検出装置
US20100027030A1 (en) Angular displacement sensor
JP3149400B2 (ja) 半導体ウェーハ抵抗率測定器
JP2997360B2 (ja) 位置合わせ装置
JPH0716238Y2 (ja) 指針の読み取り装置
JPS61258420A (ja) 位置検出装置
JPH0350752A (ja) ウェハアライメント方法、及びその装置
JPH1070177A (ja) 円板形状体の位置決め方法及び装置
JPS6266110A (ja) 光学的距離検知装置
JP3039645B1 (ja) 電子部品の位置認識方法及び装置
JPH07198336A (ja) 位置決め装置
JP2001209978A (ja) ディスクの位置決め方法
JPH0530304B2 (enrdf_load_stackoverflow)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term