GB2157078B - Wafer alignment apparatus - Google Patents

Wafer alignment apparatus

Info

Publication number
GB2157078B
GB2157078B GB08502075A GB8502075A GB2157078B GB 2157078 B GB2157078 B GB 2157078B GB 08502075 A GB08502075 A GB 08502075A GB 8502075 A GB8502075 A GB 8502075A GB 2157078 B GB2157078 B GB 2157078B
Authority
GB
United Kingdom
Prior art keywords
alignment apparatus
wafer alignment
wafer
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08502075A
Other languages
English (en)
Other versions
GB2157078A (en
GB8502075D0 (en
Inventor
Daniel N Galburt
Jere D Buckley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Biosystems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Publication of GB8502075D0 publication Critical patent/GB8502075D0/en
Publication of GB2157078A publication Critical patent/GB2157078A/en
Application granted granted Critical
Publication of GB2157078B publication Critical patent/GB2157078B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB08502075A 1984-03-30 1985-01-28 Wafer alignment apparatus Expired GB2157078B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59518884A 1984-03-30 1984-03-30

Publications (3)

Publication Number Publication Date
GB8502075D0 GB8502075D0 (en) 1985-02-27
GB2157078A GB2157078A (en) 1985-10-16
GB2157078B true GB2157078B (en) 1987-09-30

Family

ID=24382131

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08502075A Expired GB2157078B (en) 1984-03-30 1985-01-28 Wafer alignment apparatus

Country Status (3)

Country Link
JP (1) JPS60218853A (enrdf_load_stackoverflow)
DE (1) DE3506782C2 (enrdf_load_stackoverflow)
GB (1) GB2157078B (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3752234T2 (de) * 1986-04-28 1999-05-12 Varian Associates, Inc., Palo Alto, Calif. Transfersystem für Halbleiterscheibe
IL86514A0 (enrdf_load_stackoverflow) * 1988-05-26 1988-11-15
DE19510230C2 (de) * 1995-03-24 1999-08-05 Michael Geringer Transfervorrichtung für elektrische Bauelemente, insbesondere Chips
GB2337111B (en) * 1996-06-15 2000-03-15 Unova Uk Ltd Workpiece inspection
AU3042297A (en) * 1996-06-15 1998-01-07 Unova U.K. Limited Workpiece inspection and handling
US6162008A (en) * 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
DE19957758C2 (de) 1999-12-01 2001-10-25 Steag Rtp Systems Gmbh Vorrichtung und Verfahren zum Ausrichten von scheibenförmigen Substraten
KR20020087481A (ko) 2000-04-07 2002-11-22 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 갈륨비소 웨이퍼용 웨이퍼 배향 센서
DE102004025150B4 (de) * 2004-05-21 2019-05-09 Mattson Technology, Inc. Lagebestimmung eines Halbleitersubstrats auf einer Rotationsvorrichtung
US9377416B2 (en) * 2014-05-17 2016-06-28 Kla-Tencor Corp. Wafer edge detection and inspection
GB201721722D0 (en) 2017-12-22 2018-02-07 Pilkington Group Ltd Switching device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3604940A (en) * 1969-08-04 1971-09-14 Laser Systems Corp Radiant energy inspection system for rotating objects
US3826576A (en) * 1972-12-20 1974-07-30 Goodyear Aerospace Corp Laser measuring or monitoring system
US4425075A (en) * 1981-04-20 1984-01-10 The Perkin-Elmer Corporation Wafer aligners
JPS57198642A (en) * 1981-05-30 1982-12-06 Toshiba Corp Wafer position detection device
JPS5864043A (ja) * 1981-10-13 1983-04-16 Nippon Telegr & Teleph Corp <Ntt> 円板形状体の位置決め装置

Also Published As

Publication number Publication date
GB2157078A (en) 1985-10-16
GB8502075D0 (en) 1985-02-27
JPS60218853A (ja) 1985-11-01
DE3506782A1 (de) 1985-10-10
DE3506782C2 (de) 1994-10-27
JPH0556653B2 (enrdf_load_stackoverflow) 1993-08-20

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Effective date: 20050127