JPS57198642A - Wafer position detection device - Google Patents

Wafer position detection device

Info

Publication number
JPS57198642A
JPS57198642A JP8347281A JP8347281A JPS57198642A JP S57198642 A JPS57198642 A JP S57198642A JP 8347281 A JP8347281 A JP 8347281A JP 8347281 A JP8347281 A JP 8347281A JP S57198642 A JPS57198642 A JP S57198642A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
position
wafer
maximum
signal
bit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8347281A
Inventor
Sumio Nagashima
Kenichi Sato
Nobushi Suzuki
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Abstract

PURPOSE:To easily detect the orientation flat OF of a wafer without contact by using an optical method. CONSTITUTION:Pulse driving is applied to a board by a command from an information processing device 10. Irradiation light 6 is condensed 8 through a transparent adhesive sheet 4 and the image of the end finge 5a of a wafer is imaged on a photoelectric conversion element 7. A detection signal is processed 10 by binary code 9. The input signal to the device 10 is synchronized with the output signal (driving command). Now, the information from the element 7 is read to obtain a light and shade inversion bit position and observation is continued until a pulse motor run by one turn and the position of the end fringe 5b of the wafer is obtained. Next, the maximum value a and the minimum value b of average slope of each bit position are calculated and the maximum point c of the bit position is decided as OF5a and detected at the middle of the maximum and minimum values and the number of pulses of the motor 1 at the maximum point c is computed to know the position of the OF5a of the wafer.
JP8347281A 1981-05-30 1981-05-30 Wafer position detection device Pending JPS57198642A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8347281A JPS57198642A (en) 1981-05-30 1981-05-30 Wafer position detection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8347281A JPS57198642A (en) 1981-05-30 1981-05-30 Wafer position detection device

Publications (1)

Publication Number Publication Date
JPS57198642A true true JPS57198642A (en) 1982-12-06

Family

ID=13803400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8347281A Pending JPS57198642A (en) 1981-05-30 1981-05-30 Wafer position detection device

Country Status (1)

Country Link
JP (1) JPS57198642A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080241A (en) * 1983-10-07 1985-05-08 Hitachi Ltd Alignment apparatus
JPS60218853A (en) * 1984-03-30 1985-11-01 Perkin Elmer Corp Wafer front aligning device
JPS61254304A (en) * 1985-05-02 1986-11-12 Nitto Electric Ind Co Method of positioning wafer
JPS6245039A (en) * 1985-08-23 1987-02-27 Canon Inc Angle positioning device of circular sheet element
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
EP0639855A1 (en) * 1993-08-19 1995-02-22 Tokyo Seimitsu Co.,Ltd. Apparatus for recognizing the shape of a semiconductor wafer
GB2395841A (en) * 2002-10-24 2004-06-02 Lintec Corp Aligning thinned semiconductor wafers

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080241A (en) * 1983-10-07 1985-05-08 Hitachi Ltd Alignment apparatus
JPS60218853A (en) * 1984-03-30 1985-11-01 Perkin Elmer Corp Wafer front aligning device
JPH0556653B2 (en) * 1984-03-30 1993-08-20 Esu Bui Jii Ritogurafuii Shisu
JPS61254304A (en) * 1985-05-02 1986-11-12 Nitto Electric Ind Co Method of positioning wafer
JPH054201B2 (en) * 1985-05-02 1993-01-19 Nitto Denko Corp
JPS6245039A (en) * 1985-08-23 1987-02-27 Canon Inc Angle positioning device of circular sheet element
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
JPH0530304B2 (en) * 1985-08-23 1993-05-07 Canon Kk
EP0639855A1 (en) * 1993-08-19 1995-02-22 Tokyo Seimitsu Co.,Ltd. Apparatus for recognizing the shape of a semiconductor wafer
US6014965A (en) * 1993-08-19 2000-01-18 Tokyo Seimitsu Co., Ltd. Apparatus for recognizing the shape of a semiconductor wafer
GB2395841A (en) * 2002-10-24 2004-06-02 Lintec Corp Aligning thinned semiconductor wafers
GB2395841B (en) * 2002-10-24 2006-01-04 Lintec Corp Alignment apparatus
US7274452B2 (en) 2002-10-24 2007-09-25 Lintec Corporation Alignment apparatus

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