JPS60198762A - ピン付基板およびその製造方法 - Google Patents
ピン付基板およびその製造方法Info
- Publication number
- JPS60198762A JPS60198762A JP59054911A JP5491184A JPS60198762A JP S60198762 A JPS60198762 A JP S60198762A JP 59054911 A JP59054911 A JP 59054911A JP 5491184 A JP5491184 A JP 5491184A JP S60198762 A JPS60198762 A JP S60198762A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- group
- metal layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W70/66—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59054911A JPS60198762A (ja) | 1984-03-22 | 1984-03-22 | ピン付基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59054911A JPS60198762A (ja) | 1984-03-22 | 1984-03-22 | ピン付基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60198762A true JPS60198762A (ja) | 1985-10-08 |
| JPH0231502B2 JPH0231502B2 (enExample) | 1990-07-13 |
Family
ID=12983780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59054911A Granted JPS60198762A (ja) | 1984-03-22 | 1984-03-22 | ピン付基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60198762A (enExample) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119663A (ja) * | 1981-12-31 | 1983-07-16 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 接続ピンの結合方法 |
-
1984
- 1984-03-22 JP JP59054911A patent/JPS60198762A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58119663A (ja) * | 1981-12-31 | 1983-07-16 | インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン | 接続ピンの結合方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231502B2 (enExample) | 1990-07-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |