JPH0230185B2 - - Google Patents

Info

Publication number
JPH0230185B2
JPH0230185B2 JP59054909A JP5490984A JPH0230185B2 JP H0230185 B2 JPH0230185 B2 JP H0230185B2 JP 59054909 A JP59054909 A JP 59054909A JP 5490984 A JP5490984 A JP 5490984A JP H0230185 B2 JPH0230185 B2 JP H0230185B2
Authority
JP
Japan
Prior art keywords
gold
brazing
ceramic substrate
layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59054909A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60198760A (ja
Inventor
Juzo Shimada
Kazuaki Uchiumi
Masanori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59054909A priority Critical patent/JPS60198760A/ja
Publication of JPS60198760A publication Critical patent/JPS60198760A/ja
Publication of JPH0230185B2 publication Critical patent/JPH0230185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W90/701—
    • H10W72/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K3/3465—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP59054909A 1984-03-22 1984-03-22 ろう付け方法 Granted JPS60198760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59054909A JPS60198760A (ja) 1984-03-22 1984-03-22 ろう付け方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59054909A JPS60198760A (ja) 1984-03-22 1984-03-22 ろう付け方法

Publications (2)

Publication Number Publication Date
JPS60198760A JPS60198760A (ja) 1985-10-08
JPH0230185B2 true JPH0230185B2 (enExample) 1990-07-04

Family

ID=12983724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59054909A Granted JPS60198760A (ja) 1984-03-22 1984-03-22 ろう付け方法

Country Status (1)

Country Link
JP (1) JPS60198760A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0132364Y2 (enExample) * 1985-03-04 1989-10-03

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4824009A (en) * 1981-12-31 1989-04-25 International Business Machines Corporation Process for braze attachment of electronic package members

Also Published As

Publication number Publication date
JPS60198760A (ja) 1985-10-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term