JPS601855A - Manufacture of resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To enable to alter the size and shape of a heat sink unit with the same resin-sealing facility by securing a semiconductor element onto a metal substrate, covering the element via resin, then cutting the substrate except the arbitrary shape and size part. CONSTITUTION:After both sides of parts of a metal substrate 1 for supporting a semiconductor element are exposed and a semiconductor element is covered with resin 5, the exposed parts of the substrate 1 are cut except the prescribed shape and size parts. Cutting can be facilitated simply by a hydraulic press or the like. Thus, resin-sealed semiconductor devices of different shapes and sizes of a heat sink unit 11 can be manufactured in the same facility, thereby improving the using efficiency of a semiconductor device manufacturing facility, simplifying the production management and reducing the manufacturing cost.

Description

Detailed description of the invention [Technical field to which the invention pertains] The present invention relates to a resin sealing method in which both sides of a part of a metal substrate to which a semiconductor element is fixed are exposed for heat radiation, and the semiconductor element is sealed with resin. The present invention relates to a method of manufacturing a static semiconductor device.

[Prior art and its problems]

As such a semiconductor device, a JEDEC To-220 type semiconductor device as shown in FIGS. 1 and 2, for example, is known. In this type, although not shown, a semiconductor element,
For example, a transistor chip is brazed onto a metal substrate 1, and includes emitter terminals 2, paste terminals 3, and collector terminals 4 connected to the metal substrate. A resin 5 is cast onto the resin 5, exposing a portion of the opposite side of the resin 5. This semiconductor device is fixed to a cooling body using a 66, and most of the heat of the semiconductor element is radiated to the cooling body through the exposed portion of the substrate 1. Such resin sealing equipment for semiconductor devices can only be used to manufacture semiconductor devices of the same shape using a mold for resin casting. However, semiconductor devices must be designed with different shapes and dimensions depending on the type of element or location of use.

For example, an element for a hybrid integrated circuit does not itself require a heat sink, and it is desirable to reduce the area of the substrate and the mounting area of the element on the circuit support board.

Conventionally, resin sealing equipment had to be prepared each time such semiconductor devices with different shapes and dimensions of heat sinks were manufactured.

[Purpose of the invention]

The present invention provides a manufacturing method for a resin-sealed semiconductor device in which a portion of a substrate is exposed on both sides and used as a heat sink, in which the dimensions and shape of the heat sink can be changed using the same resin sealing equipment. The purpose is to provide.

[Key points of the invention]

The present invention involves exposing both sides of a part of a metal substrate that supports a semiconductor element, coating the semiconductor element with resin, and then cutting the exposed portion of the substrate leaving a portion of a predetermined shape and size. To achieve the above objectives.

[Embodiments of the invention]

FIGS. 3 and 4 show a resin-sealed semiconductor device N'? according to an embodiment of the present invention. : The same parts as in FIGS. 1 and 2 are given the same reference numerals.

This semiconductor device is manufactured using the same equipment as the semiconductor device shown in FIGS. 1 and 2, and therefore the metal substrate has the same dimensions and shape as the substrate 1 shown in FIGS. 1 and 2. However, in the final step after sealing, it was cut leaving the radiator 11. In this way, a resin-sealed semiconductor device having a heat sink shape different from the semiconductor device shown in FIGS. 1 and 2 was obtained.

Cutting can be easily done using a hydraulic press or the like.

〔Effect of the invention〕

In the present invention, a semiconductor element is fixed onto a metal substrate of the same shape and size, and the semiconductor element is covered with resin using the same resin sealing equipment, and then the metal substrate is left with a portion of an arbitrary shape and size. This makes it possible to manufacture resin-encapsulated semiconductor devices with different shapes and sizes of heatsinks in the same equipment by cutting the heatsink using the same equipment, which improves the efficiency of semiconductor device manufacturing equipment usage, simplifies production management, and reduces manufacturing costs. It was possible to achieve such effects.

[Brief explanation of drawings]

FIG. 1 is a plan view of a To-22Q type semiconductor device, FIG. 2 is a side view thereof, FIG. 3 is a plan view of a completed semiconductor device according to an embodiment of the present invention, and FIG. 4 is a side view thereof. be. l... Metal substrate, 11... Metal substrate after cutting (radiator), 5... Resin. Figure 1 Figure 3 Figure 2 [! 1 Figure 4

Claims (1)

[Claims] 1) After fixing a semiconductor element onto a metal substrate, exposing both sides of a part of the metal substrate, and covering the semiconductor element with a resin, the exposed portion of the metal substrate is shaped into a portion having a predetermined shape and size. 1. A method for manufacturing a resin-sealed semiconductor device, characterized in that the device is cut while leaving a .