JPS5384560A - Manufacture for mould type semiconductor device - Google Patents

Manufacture for mould type semiconductor device

Info

Publication number
JPS5384560A
JPS5384560A JP16030076A JP16030076A JPS5384560A JP S5384560 A JPS5384560 A JP S5384560A JP 16030076 A JP16030076 A JP 16030076A JP 16030076 A JP16030076 A JP 16030076A JP S5384560 A JPS5384560 A JP S5384560A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
type semiconductor
mould type
mould
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16030076A
Other languages
Japanese (ja)
Inventor
Muneyasu Tomiki
Kazuya Takahashi
Hiroshi Mugitani
Yoshiaki Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16030076A priority Critical patent/JPS5384560A/en
Publication of JPS5384560A publication Critical patent/JPS5384560A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To make easy the lead cut off, by constituting the load tip as smoooth projection.
JP16030076A 1976-12-29 1976-12-29 Manufacture for mould type semiconductor device Pending JPS5384560A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16030076A JPS5384560A (en) 1976-12-29 1976-12-29 Manufacture for mould type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16030076A JPS5384560A (en) 1976-12-29 1976-12-29 Manufacture for mould type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5384560A true JPS5384560A (en) 1978-07-26

Family

ID=15711973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16030076A Pending JPS5384560A (en) 1976-12-29 1976-12-29 Manufacture for mould type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5384560A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103825A (en) * 1978-01-27 1979-08-15 Agfa Gevaert Ag Manufacture of sulfoalkyl quaternary salt
JPS601855A (en) * 1983-06-20 1985-01-08 Fuji Electric Co Ltd Manufacture of resin-sealed semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944160B1 (en) * 1965-11-12 1974-11-26

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4944160B1 (en) * 1965-11-12 1974-11-26

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54103825A (en) * 1978-01-27 1979-08-15 Agfa Gevaert Ag Manufacture of sulfoalkyl quaternary salt
JPS6237625B2 (en) * 1978-01-27 1987-08-13 Agfa Gevaert Ag
JPS601855A (en) * 1983-06-20 1985-01-08 Fuji Electric Co Ltd Manufacture of resin-sealed semiconductor device

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