JPS60178687A - 高熱伝導性回路基板 - Google Patents

高熱伝導性回路基板

Info

Publication number
JPS60178687A
JPS60178687A JP3416384A JP3416384A JPS60178687A JP S60178687 A JPS60178687 A JP S60178687A JP 3416384 A JP3416384 A JP 3416384A JP 3416384 A JP3416384 A JP 3416384A JP S60178687 A JPS60178687 A JP S60178687A
Authority
JP
Japan
Prior art keywords
circuit board
thermal conductivity
substrate
high thermal
paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3416384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0570954B2 (forum.php
Inventor
岩瀬　暢男
安斎　和雄
和夫 篠崎
加曽利　光男
柘植　章彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP3416384A priority Critical patent/JPS60178687A/ja
Priority to EP85102159A priority patent/EP0153737B1/en
Priority to US06/706,280 priority patent/US4659611A/en
Priority to DE85102159T priority patent/DE3587481T2/de
Publication of JPS60178687A publication Critical patent/JPS60178687A/ja
Publication of JPH0570954B2 publication Critical patent/JPH0570954B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
JP3416384A 1984-02-27 1984-02-27 高熱伝導性回路基板 Granted JPS60178687A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3416384A JPS60178687A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板
EP85102159A EP0153737B1 (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
US06/706,280 US4659611A (en) 1984-02-27 1985-02-27 Circuit substrate having high thermal conductivity
DE85102159T DE3587481T2 (de) 1984-02-27 1985-02-27 Schaltungssubstrat mit hoher Wärmeleitfähigkeit.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3416384A JPS60178687A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板

Publications (2)

Publication Number Publication Date
JPS60178687A true JPS60178687A (ja) 1985-09-12
JPH0570954B2 JPH0570954B2 (forum.php) 1993-10-06

Family

ID=12406537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3416384A Granted JPS60178687A (ja) 1984-02-27 1984-02-27 高熱伝導性回路基板

Country Status (1)

Country Link
JP (1) JPS60178687A (forum.php)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6135555A (ja) * 1984-07-27 1986-02-20 Nec Corp 厚膜混成集積回路装置
JPS6284595A (ja) * 1985-10-08 1987-04-18 日本電気株式会社 多層セラミック配線基板
JPS62232149A (ja) * 1986-03-31 1987-10-12 Ibiden Co Ltd 窒化アルミニウム質焼結体よりなる配線基板とその製造方法
JPS63291303A (ja) * 1987-05-22 1988-11-29 Matsushita Electric Ind Co Ltd メタライズ組成物
JPS63291304A (ja) * 1987-05-22 1988-11-29 Matsushita Electric Ind Co Ltd メタライズ組成物
JPH01117093A (ja) * 1987-10-29 1989-05-09 Ibiden Co Ltd 窒化アルミニウム質多層基板
JPH02197189A (ja) * 1988-11-14 1990-08-03 Shinko Electric Ind Co Ltd 窒化アルミニウム回路基板及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107573071B (zh) * 2017-09-28 2020-05-12 东北大学 一种单分散球形Y2O3和Al2O3粉制备(Y1-xYbx)AG透明陶瓷的方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6135555A (ja) * 1984-07-27 1986-02-20 Nec Corp 厚膜混成集積回路装置
JPS6284595A (ja) * 1985-10-08 1987-04-18 日本電気株式会社 多層セラミック配線基板
JPS62232149A (ja) * 1986-03-31 1987-10-12 Ibiden Co Ltd 窒化アルミニウム質焼結体よりなる配線基板とその製造方法
JPS63291303A (ja) * 1987-05-22 1988-11-29 Matsushita Electric Ind Co Ltd メタライズ組成物
JPS63291304A (ja) * 1987-05-22 1988-11-29 Matsushita Electric Ind Co Ltd メタライズ組成物
JPH01117093A (ja) * 1987-10-29 1989-05-09 Ibiden Co Ltd 窒化アルミニウム質多層基板
JPH02197189A (ja) * 1988-11-14 1990-08-03 Shinko Electric Ind Co Ltd 窒化アルミニウム回路基板及びその製造方法

Also Published As

Publication number Publication date
JPH0570954B2 (forum.php) 1993-10-06

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