JPS60176251A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60176251A
JPS60176251A JP3285684A JP3285684A JPS60176251A JP S60176251 A JPS60176251 A JP S60176251A JP 3285684 A JP3285684 A JP 3285684A JP 3285684 A JP3285684 A JP 3285684A JP S60176251 A JPS60176251 A JP S60176251A
Authority
JP
Japan
Prior art keywords
wiring
layer
wiring layers
layer wiring
upper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3285684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230180B2 (en:Method
Inventor
Tsutomu Akashi
勉 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3285684A priority Critical patent/JPS60176251A/ja
Publication of JPS60176251A publication Critical patent/JPS60176251A/ja
Publication of JPH0230180B2 publication Critical patent/JPH0230180B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP3285684A 1984-02-23 1984-02-23 半導体装置 Granted JPS60176251A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3285684A JPS60176251A (ja) 1984-02-23 1984-02-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3285684A JPS60176251A (ja) 1984-02-23 1984-02-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS60176251A true JPS60176251A (ja) 1985-09-10
JPH0230180B2 JPH0230180B2 (en:Method) 1990-07-04

Family

ID=12370479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3285684A Granted JPS60176251A (ja) 1984-02-23 1984-02-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS60176251A (en:Method)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5317185A (en) * 1990-11-06 1994-05-31 Motorola, Inc. Semiconductor device having structures to reduce stress notching effects in conductive lines and method for making the same
US5462767A (en) * 1985-09-21 1995-10-31 Semiconductor Energy Laboratory Co., Ltd. CVD of conformal coatings over a depression using alkylmetal precursors
US5567989A (en) * 1993-07-27 1996-10-22 Samsung Electronics Co., Ltd. Highly integrated semiconductor wiring structure
US5894170A (en) * 1996-08-29 1999-04-13 Nec Corporation Wiring layer in semiconductor device
JP2010034236A (ja) * 2008-07-28 2010-02-12 Panasonic Corp 固体撮像装置及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791523A (en) * 1980-11-28 1982-06-07 Fujitsu Ltd Manufacture of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791523A (en) * 1980-11-28 1982-06-07 Fujitsu Ltd Manufacture of semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5462767A (en) * 1985-09-21 1995-10-31 Semiconductor Energy Laboratory Co., Ltd. CVD of conformal coatings over a depression using alkylmetal precursors
US5317185A (en) * 1990-11-06 1994-05-31 Motorola, Inc. Semiconductor device having structures to reduce stress notching effects in conductive lines and method for making the same
US5567989A (en) * 1993-07-27 1996-10-22 Samsung Electronics Co., Ltd. Highly integrated semiconductor wiring structure
US5894170A (en) * 1996-08-29 1999-04-13 Nec Corporation Wiring layer in semiconductor device
JP2010034236A (ja) * 2008-07-28 2010-02-12 Panasonic Corp 固体撮像装置及びその製造方法

Also Published As

Publication number Publication date
JPH0230180B2 (en:Method) 1990-07-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees