JPS60170955A - 製造工程管理用半導体装置 - Google Patents

製造工程管理用半導体装置

Info

Publication number
JPS60170955A
JPS60170955A JP59027619A JP2761984A JPS60170955A JP S60170955 A JPS60170955 A JP S60170955A JP 59027619 A JP59027619 A JP 59027619A JP 2761984 A JP2761984 A JP 2761984A JP S60170955 A JPS60170955 A JP S60170955A
Authority
JP
Japan
Prior art keywords
manufacturing process
inverters
process control
semiconductor
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59027619A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576776B2 (enExample
Inventor
Masashi Yasuki
安木 正志
Minoru Shioda
塩田 稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP59027619A priority Critical patent/JPS60170955A/ja
Publication of JPS60170955A publication Critical patent/JPS60170955A/ja
Publication of JPH0576776B2 publication Critical patent/JPH0576776B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP59027619A 1984-02-15 1984-02-15 製造工程管理用半導体装置 Granted JPS60170955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59027619A JPS60170955A (ja) 1984-02-15 1984-02-15 製造工程管理用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59027619A JPS60170955A (ja) 1984-02-15 1984-02-15 製造工程管理用半導体装置

Publications (2)

Publication Number Publication Date
JPS60170955A true JPS60170955A (ja) 1985-09-04
JPH0576776B2 JPH0576776B2 (enExample) 1993-10-25

Family

ID=12225958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59027619A Granted JPS60170955A (ja) 1984-02-15 1984-02-15 製造工程管理用半導体装置

Country Status (1)

Country Link
JP (1) JPS60170955A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010103696A1 (ja) 2009-03-11 2010-09-16 シャープ株式会社 電子回路、電子装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832490A (enExample) * 1971-09-01 1973-04-28
JPS57133644A (en) * 1981-02-12 1982-08-18 Fujitsu Ltd Semiconductor integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832490A (enExample) * 1971-09-01 1973-04-28
JPS57133644A (en) * 1981-02-12 1982-08-18 Fujitsu Ltd Semiconductor integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010103696A1 (ja) 2009-03-11 2010-09-16 シャープ株式会社 電子回路、電子装置

Also Published As

Publication number Publication date
JPH0576776B2 (enExample) 1993-10-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees