JPS60169196A - 多層回路基板の製造方法 - Google Patents

多層回路基板の製造方法

Info

Publication number
JPS60169196A
JPS60169196A JP2646484A JP2646484A JPS60169196A JP S60169196 A JPS60169196 A JP S60169196A JP 2646484 A JP2646484 A JP 2646484A JP 2646484 A JP2646484 A JP 2646484A JP S60169196 A JPS60169196 A JP S60169196A
Authority
JP
Japan
Prior art keywords
circuit board
multilayer circuit
pattern
insulating resin
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2646484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH021389B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
和弘 小林
羽山　昌宏
剛 田渕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2646484A priority Critical patent/JPS60169196A/ja
Publication of JPS60169196A publication Critical patent/JPS60169196A/ja
Publication of JPH021389B2 publication Critical patent/JPH021389B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2646484A 1984-02-13 1984-02-13 多層回路基板の製造方法 Granted JPS60169196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2646484A JPS60169196A (ja) 1984-02-13 1984-02-13 多層回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2646484A JPS60169196A (ja) 1984-02-13 1984-02-13 多層回路基板の製造方法

Publications (2)

Publication Number Publication Date
JPS60169196A true JPS60169196A (ja) 1985-09-02
JPH021389B2 JPH021389B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-01-11

Family

ID=12194233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2646484A Granted JPS60169196A (ja) 1984-02-13 1984-02-13 多層回路基板の製造方法

Country Status (1)

Country Link
JP (1) JPS60169196A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56157053A (en) * 1980-05-09 1981-12-04 Hitachi Ltd Manufacture of thick film hybrid ic plate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56157053A (en) * 1980-05-09 1981-12-04 Hitachi Ltd Manufacture of thick film hybrid ic plate

Also Published As

Publication number Publication date
JPH021389B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-01-11

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees